ZHCSOK7B March   2020  – May 2021 CC3130

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 功能方框图
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Pin Attributes
    3. 7.3 Signal Descriptions
      1.      12
    4. 7.4 Connections for Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Current Consumption Summary
    6. 8.6  TX Power Control
    7. 8.7  Brownout and Blackout Conditions
      1. 8.7.1 Brownout and Blackout Voltage Levels
    8. 8.8  Electrical Characteristics for DIO Pins
      1. 8.8.1 Electrical Characteristics: DIO Pins Except 52 and 53
      2. 8.8.2 Electrical Characteristics: DIO Pins 52 and 53
    9. 8.9  Electrical Characteristics for Pin Internal Pullup and Pulldown
    10. 8.10 WLAN Receiver Characteristics
      1.      28
    11. 8.11 WLAN Transmitter Characteristics
      1.      30
    12. 8.12 WLAN Transmitter Out-of-Band Emissions
      1. 8.12.1 WLAN 2.4 GHz Filter Requirements
    13. 8.13 BLE/2.4 GHz Radio Coexistence and WLAN Coexistence Requirements
    14. 8.14 Thermal Resistance Characteristics for RGK Package
    15. 8.15 Timing and Switching Characteristics
      1. 8.15.1 Power Supply Sequencing
      2. 8.15.2 Device Reset
      3. 8.15.3 Reset Timing
        1. 8.15.3.1 nRESET (32-kHz Crystal)
        2. 8.15.3.2 First-Time Power-Up and Reset Removal Timing Requirements (32-kHz Crystal)
        3. 8.15.3.3 nRESET (External 32-kHz Crystal)
          1. 8.15.3.3.1 First-Time Power-Up and Reset Removal Timing Requirements (External 32-kHz Crystal)
      4. 8.15.4 Wakeup From HIBERNATE Mode
        1. 8.15.4.1 nHIB Timing Requirements
      5. 8.15.5 Clock Specifications
        1. 8.15.5.1 Slow Clock Using Internal Oscillator
          1. 8.15.5.1.1 RTC Crystal Requirements
        2. 8.15.5.2 Slow Clock Using an External Clock
          1. 8.15.5.2.1 External RTC Digital Clock Requirements
        3. 8.15.5.3 Fast Clock (Fref) Using an External Crystal
          1. 8.15.5.3.1 WLAN Fast-Clock Crystal Requirements
        4. 8.15.5.4 Fast Clock (Fref) Using an External Oscillator
          1. 8.15.5.4.1 External Fref Clock Requirements (–40°C to +85°C)
      6. 8.15.6 Interfaces
        1. 8.15.6.1 Host SPI Interface Timing
          1. 8.15.6.1.1 Host SPI Interface Timing Parameters
        2. 8.15.6.2 Flash SPI Interface Timing
          1. 8.15.6.2.1 Flash SPI Interface Timing Parameters
        3. 8.15.6.3 DIO Interface Timing
          1. 8.15.6.3.1 DIO Output Transition Time Parameters (Vsupply = 3.3 V)
            1. 8.15.6.3.1.1 DIO Output Transition Times (Vsupply = 3.3 V) (1)
          2. 8.15.6.3.2 DIO Input Transition Time Parameters
            1. 8.15.6.3.2.1 DIO Input Transition Time Parameters
    16. 8.16 External Interfaces
      1. 8.16.1 SPI Flash Interface
      2. 8.16.2 SPI Host Interface
      3. 8.16.3 Host UART Interface
        1. 8.16.3.1 5-Wire UART Topology
        2. 8.16.3.2 4-Wire UART Topology
        3. 8.16.3.3 3-Wire UART Topology
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Device Features
      1. 9.2.1 WLAN
      2. 9.2.2 Network Stack
      3. 9.2.3 Security
      4. 9.2.4 Host Interface and Driver
      5. 9.2.5 System
    3. 9.3 Power-Management Subsystem
      1. 9.3.1 VBAT Wide-Voltage Connection
    4. 9.4 Low-Power Operating Modes
      1. 9.4.1 Low-Power Deep Sleep
      2. 9.4.2 Hibernate
      3. 9.4.3 Shutdown
    5. 9.5 Memory
      1. 9.5.1 External Memory Requirements
    6. 9.6 Restoring Factory Default Configuration
    7. 9.7 Hostless Mode
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 BLE/2.4 GHz Radio Coexistence
      2. 10.1.2 Antenna Selection
      3. 10.1.3 Typical Application
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General PCB Guidelines
      2. 10.2.2 Power Layout and Routing
        1. 10.2.2.1 Design Considerations
      3. 10.2.3 Clock Interface Guidelines
      4. 10.2.4 Digital Input and Output Guidelines
      5. 10.2.5 RF Interface Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Tools and Software
    2. 11.2 Firmware Updates
    3. 11.3 Device Nomenclature
    4. 11.4 Documentation Support
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information
      2. 12.1.2 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12.1.1 Packaging Information

Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish(3) MSL Peak Temp (4) Op Temp (°C) Device Marking(5)(6)
CC3130RNMRGKR PREVIEW VQFN RGK 64 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-3-260C-168 HR -40 to 85 CC3130RNM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
(4) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(5) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
(6) Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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