ZHCSOK7B March   2020  – May 2021 CC3130

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 功能方框图
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Pin Attributes
    3. 7.3 Signal Descriptions
      1.      12
    4. 7.4 Connections for Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Current Consumption Summary
    6. 8.6  TX Power Control
    7. 8.7  Brownout and Blackout Conditions
      1. 8.7.1 Brownout and Blackout Voltage Levels
    8. 8.8  Electrical Characteristics for DIO Pins
      1. 8.8.1 Electrical Characteristics: DIO Pins Except 52 and 53
      2. 8.8.2 Electrical Characteristics: DIO Pins 52 and 53
    9. 8.9  Electrical Characteristics for Pin Internal Pullup and Pulldown
    10. 8.10 WLAN Receiver Characteristics
      1.      28
    11. 8.11 WLAN Transmitter Characteristics
      1.      30
    12. 8.12 WLAN Transmitter Out-of-Band Emissions
      1. 8.12.1 WLAN 2.4 GHz Filter Requirements
    13. 8.13 BLE/2.4 GHz Radio Coexistence and WLAN Coexistence Requirements
    14. 8.14 Thermal Resistance Characteristics for RGK Package
    15. 8.15 Timing and Switching Characteristics
      1. 8.15.1 Power Supply Sequencing
      2. 8.15.2 Device Reset
      3. 8.15.3 Reset Timing
        1. 8.15.3.1 nRESET (32-kHz Crystal)
        2. 8.15.3.2 First-Time Power-Up and Reset Removal Timing Requirements (32-kHz Crystal)
        3. 8.15.3.3 nRESET (External 32-kHz Crystal)
          1. 8.15.3.3.1 First-Time Power-Up and Reset Removal Timing Requirements (External 32-kHz Crystal)
      4. 8.15.4 Wakeup From HIBERNATE Mode
        1. 8.15.4.1 nHIB Timing Requirements
      5. 8.15.5 Clock Specifications
        1. 8.15.5.1 Slow Clock Using Internal Oscillator
          1. 8.15.5.1.1 RTC Crystal Requirements
        2. 8.15.5.2 Slow Clock Using an External Clock
          1. 8.15.5.2.1 External RTC Digital Clock Requirements
        3. 8.15.5.3 Fast Clock (Fref) Using an External Crystal
          1. 8.15.5.3.1 WLAN Fast-Clock Crystal Requirements
        4. 8.15.5.4 Fast Clock (Fref) Using an External Oscillator
          1. 8.15.5.4.1 External Fref Clock Requirements (–40°C to +85°C)
      6. 8.15.6 Interfaces
        1. 8.15.6.1 Host SPI Interface Timing
          1. 8.15.6.1.1 Host SPI Interface Timing Parameters
        2. 8.15.6.2 Flash SPI Interface Timing
          1. 8.15.6.2.1 Flash SPI Interface Timing Parameters
        3. 8.15.6.3 DIO Interface Timing
          1. 8.15.6.3.1 DIO Output Transition Time Parameters (Vsupply = 3.3 V)
            1. 8.15.6.3.1.1 DIO Output Transition Times (Vsupply = 3.3 V) (1)
          2. 8.15.6.3.2 DIO Input Transition Time Parameters
            1. 8.15.6.3.2.1 DIO Input Transition Time Parameters
    16. 8.16 External Interfaces
      1. 8.16.1 SPI Flash Interface
      2. 8.16.2 SPI Host Interface
      3. 8.16.3 Host UART Interface
        1. 8.16.3.1 5-Wire UART Topology
        2. 8.16.3.2 4-Wire UART Topology
        3. 8.16.3.3 3-Wire UART Topology
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Device Features
      1. 9.2.1 WLAN
      2. 9.2.2 Network Stack
      3. 9.2.3 Security
      4. 9.2.4 Host Interface and Driver
      5. 9.2.5 System
    3. 9.3 Power-Management Subsystem
      1. 9.3.1 VBAT Wide-Voltage Connection
    4. 9.4 Low-Power Operating Modes
      1. 9.4.1 Low-Power Deep Sleep
      2. 9.4.2 Hibernate
      3. 9.4.3 Shutdown
    5. 9.5 Memory
      1. 9.5.1 External Memory Requirements
    6. 9.6 Restoring Factory Default Configuration
    7. 9.7 Hostless Mode
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 BLE/2.4 GHz Radio Coexistence
      2. 10.1.2 Antenna Selection
      3. 10.1.3 Typical Application
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General PCB Guidelines
      2. 10.2.2 Power Layout and Routing
        1. 10.2.2.1 Design Considerations
      3. 10.2.3 Clock Interface Guidelines
      4. 10.2.4 Digital Input and Output Guidelines
      5. 10.2.5 RF Interface Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Tools and Software
    2. 11.2 Firmware Updates
    3. 11.3 Device Nomenclature
    4. 11.4 Documentation Support
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information
      2. 12.1.2 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.2.5 RF Interface Guidelines

The following guidelines are for the RF interface. Follow guidelines specified in the vendor-specific antenna design guides (including placement of the antenna). Also see CC3120 and CC3220 SimpleLink™ Wi-Fi® and IoT Solution Layout Guidelines for general antenna guidelines.

  • Ensure that the antenna is matched for 50-Ω. A π-matching network is recommended. Ensure that the π pad is available for tuning the matching network after PCB manufacture.
  • Ensure that the area underneath the BPFs pads have a solid plane on layer 2 and that the minimum filter requirements are met.
  • Verify that the Wi-Fi RF trace is a 50-Ω, impedance-controlled trace with a reference to solid ground.
  • The RF trace bends must be made with gradual curves. Avoid 90-degree bends.
  • The RF traces must not have sharp corners.
  • There must be no traces or ground under the antenna section.
  • The RF traces must have via stitching on the ground plane beside the RF trace on both sides.
  • For optimal antenna performance, ensure adequate ground plane around the antenna on all layers.
  • Ensure RF connectors for conducted testing are isolated from the top layer ground using vias.
  • Maintain a controlled pad to trace shapes using filleted edges if necessary to avoid mismatch.
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