ZHCSK48D February   2019  – May 2021 CC3135MOD

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 功能方框图
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 CC3135MOD Pin Diagram
    2. 7.2 Pin Attributes
    3. 7.3 Signal Descriptions
      1.      12
    4. 7.4 Connections for Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Current Consumption Summary: 2.4 GHz RF Band
    5. 8.5  Current Consumption Summary: 5 GHz RF Band
    6. 8.6  TX Power Control for 2.4 GHz Band
    7. 8.7  TX Power Control for 5 GHz Band
    8. 8.8  Brownout and Blackout Conditions
    9. 8.9  Electrical Characteristics for DIO Pins
    10. 8.10 WLAN Receiver Characteristics
      1.      25
      2.      26
    11. 8.11 WLAN Transmitter Characteristics
      1.      28
      2.      29
    12. 8.12 BLE and WLAN Coexistence Requirements
    13. 8.13 Reset Requirement
    14. 8.14 Thermal Resistance Characteristics for MOB Package
    15. 8.15 Timing and Switching Characteristics
      1. 8.15.1 Power-Up Sequencing
      2. 8.15.2 Power-Down Sequencing
      3. 8.15.3 Device Reset
      4. 8.15.4 Wakeup From HIBERNATE Mode Timing
    16. 8.16 External Interfaces
      1. 8.16.1 SPI Host Interface
      2. 8.16.2 Host UART Interface
        1. 8.16.2.1 5-Wire UART Topology
        2. 8.16.2.2 4-Wire UART Topology
        3. 8.16.2.3 3-Wire UART Topology
      3. 8.16.3 External Flash Interface
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  Module Features
      1. 9.2.1 WLAN
      2. 9.2.2 Network Stack
        1. 9.2.2.1 Security
      3. 9.2.3 FIPS 140-2 Level 1 Certification
      4. 9.2.4 Host Interface and Driver
      5. 9.2.5 System
    3. 9.3  Power-Management Subsystem
      1. 9.3.1 VBAT Wide-Voltage Connection
    4. 9.4  Low-Power Operating Modes
      1. 9.4.1 Low-Power Deep Sleep
      2. 9.4.2 Hibernate
      3. 9.4.3 Shutdown
    5. 9.5  Restoring Factory Default Configuration
    6. 9.6  Hostless Mode
    7. 9.7  Device Certification and Qualification
      1. 9.7.1 FCC Certification and Statement
      2. 9.7.2 IC/ISED Certification Statement
      3. 9.7.3 ETSI/CE Certification
      4. 9.7.4 Japan MIC Certification
    8. 9.8  Module Markings
    9. 9.9  End Product Labeling
    10. 9.10 Manual Information to the End User
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 BLE/2.4 GHz Radio Coexistence
      2. 10.1.2 Antenna Selection
      3. 10.1.3 Typical Application
      4. 10.1.4 Power Supply Decoupling and Bulk Capacitors
      5. 10.1.5 Reset
      6. 10.1.6 Unused Pins
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General Layout Recommendations
      2. 10.2.2 RF Layout Recommendations
      3. 10.2.3 Antenna Placement and Routing
      4. 10.2.4 Transmission Line Considerations
  11. 11Environmental Requirements and SMT Specifications
    1. 11.1 Temperature
      1. 11.1.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 PCB Assembly Guide
      1. 11.4.1 PCB Land Pattern & Thermal Vias
      2. 11.4.2 SMT Assembly Recommendations
      3. 11.4.3 PCB Surface Finish Requirements
      4. 11.4.4 Solder Stencil
      5. 11.4.5 Package Placement
      6. 11.4.6 Solder Joint Inspection
      7. 11.4.7 Rework and Replacement
      8. 11.4.8 Solder Joint Voiding
    5. 11.5 Baking Conditions
    6. 11.6 Soldering and Reflow Condition
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Development Tools and Software
    3. 12.3 Firmware Updates
    4. 12.4 Documentation Support
    5. 12.5 Trademarks
    6. 12.6 静电放电警告
    7. 12.7 Export Control Notice
    8. 12.8 术语表
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
      1. 13.2.1 Packaging Information
      2. 13.2.2 Tape and Reel Information
        1. 13.2.2.1 Tape Specifications

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9.2.2.1 Security

The SimpleLink Wi-Fi CC3135MOD internet-on-a chip module enhances the security capabilities available for development of IoT devices, while completely offloading these activities from the MCU to the networking subsystem. The security capabilities include the following key features:

Wi-Fi and Internet security

  • Personal and enterprise Wi-Fi security
    • Personal standards
      • AES (WPA2-PSK)
      • TKIP (WPA-PSK)
      • WEP
  • Enterprise standards
    • EAP Fast
    • EAP PEAPv0 MSCHAPv2
    • EAP PEAPv0 TLS
    • EAP PEAPv1 TLS EAP LS
    • EAP TTLS TLS
    • EAP TTLS MSCHAPv2
  • Secure sockets
    • Protocol versions: SSL v3/TLS 1.0/TLS 1.1/TLS 1.2
    • On-chip powerful crypto engine for fast, secure Wi-Fi and internet connections with 256-bit AES encryption for TLS and SSL connections
    • Ciphers suites
      • SL_SEC_MASK_SSL_RSA_WITH_RC4_128_SHA
      • SL_SEC_MASK_SSL_RSA_WITH_RC4_128_MD5
      • SL_SEC_MASK_TLS_RSA_WITH_AES_256_CBC_SHA
      • SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_256_CBC_SHA
      • SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_256_CBC_SHA
      • SL_SEC_MASK_TLS_ECDHE_RSA_WITH_RC4_128_SHA
      • SL_SEC_MASK_TLS_RSA_WITH_AES_128_CBC_SHA256
      • SL_SEC_MASK_TLS_RSA_WITH_AES_256_CBC_SHA256
      • SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_128_CBC_SHA256
      • SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_CBC_SHA256
      • SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_CBC_SHA
      • SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_256_CBC_SHA
      • SL_SEC_MASK_TLS_RSA_WITH_AES_128_GCM_SHA256
      • SL_SEC_MASK_TLS_RSA_WITH_AES_256_GCM_SHA384
      • SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_128_GCM_SHA256
      • SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_256_GCM_SHA384
      • SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_128_GCM_SHA256
      • SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_256_GCM_SHA384
      • SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_GCM_SHA256
      • SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_256_GCM_SHA384
      • SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_CHACHA20_POLY1305_SHA256
      • SL_SEC_MASK_TLS_ECDHE_RSA_WITH_CHACHA20_POLY1305_SHA256
      • SL_SEC_MASK_TLS_DHE_RSA_WITH_CHACHA20_POLY1305_SHA256
    • Server authentication
    • Client authentication
    • Domain name verification
    • Socket upgrade to secure socket – STARTTLS
  • Secure HTTP server (HTTPS)
  • The trusted root-certificate catalog verifies that the CA used by the application is trusted and known secure content delivery.
  • The TI root-of-trust public key is a hardware-based mechanism that allows authenticating TI as the genuine origin of a given content using asymmetric keys.
  • Secure content delivery allows file transfer to the system in a secure way on any unsecured tunnel.
  • Code and data security
    • Secured network information: Network passwords and certificates are encrypted
    • Secured and authenticated service pack: SP is signed based on TI certificate
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