ZHCSCJ7E July   2013  – June 2014 CC3200

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用范围
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2修订历史记录
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Attributes and Pin Multiplexing
      1. 3.1.1 Connections for Unused Pins
      2. 3.1.2 Recommended Pin Multiplexing Configurations
    2. 3.2 Drive Strength and Reset States for Analog-Digital Multiplexed Pins
    3. 3.3 Pad State After Application of Power To Chip But Prior To Reset Release
  4. 4Specifications
    1. 4.1 Timing and Switching Characteristics
      1. 4.1.1 Power Supply Sequencing
      2. 4.1.2 Reset Timing
        1. 4.1.2.1 nRESET (32K XTAL)
        2. 4.1.2.2 nRESET (External 32K)
        3. 4.1.2.3 Wakeup from Hibernate
      3. 4.1.3 Clock Specifications
        1. 4.1.3.1 Slow Clock Using Internal Oscillator
        2. 4.1.3.2 Slow Clock Using an External Clock
        3. 4.1.3.3 Fast Clock (Fref) Using an External Crystal
        4. 4.1.3.4 Fast Clock (Fref) Using an External Oscillator
        5. 4.1.3.5 Input Clocks/Oscillators
      4. 4.1.4 Peripherals
        1. 4.1.4.1 SPI
          1. 4.1.4.1.1 SPI Master
          2. 4.1.4.1.2 SPI Slave
        2. 4.1.4.2 McASP
          1. 4.1.4.2.1 I2S Transmit Mode
          2. 4.1.4.2.2 I2S Receive Mode
        3. 4.1.4.3 GPIO
          1. 4.1.4.3.1 GPIO Output Transition Time Parameters (Vsupply = 3.3 V)
          2. 4.1.4.3.2 GPIO Output Transition Time Parameters (Vsupply = 1.8 V)
          3. 4.1.4.3.3 GPIO Input Transition Time Parameters
        4. 4.1.4.4 I2C
        5. 4.1.4.5 IEEE 1149.1 JTAG
        6. 4.1.4.6 ADC
        7. 4.1.4.7 Camera Parallel Port
        8. 4.1.4.8 UART
  5. 5Detailed Description
    1. 5.1 Overview
      1. 5.1.1 Device Features
    2. 5.2 Functional Block Diagram
    3. 5.3 ARM Cortex-M4 Processor Core Subsystem
    4. 5.4 CC3200 Device Encryption
    5. 5.5 Wi-Fi Network Processor Subsystem
    6. 5.6 Power-Management Subsystem
      1. 5.6.1 VBAT Wide-Voltage Connection
      2. 5.6.2 Preregulated 1.85 V
    7. 5.7 Low-Power Operating Mode
    8. 5.8 Memory
      1. 5.8.1 External Memory Requirements
      2. 5.8.2 Internal Memory
        1. 5.8.2.1 SRAM
        2. 5.8.2.2 ROM
        3. 5.8.2.3 Memory Map
    9. 5.9 Boot Modes
      1. 5.9.1 Overview
      2. 5.9.2 Invocation Sequence/Boot Mode Selection
      3. 5.9.3 Boot Mode List
  6. 6Applications and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Typical Application - CC3200 Wide-Voltage Mode
      2. 6.1.2 Typical Application - CC3200 Preregulated 1.85-V Mode
  7. 7器件和文档支持
    1. 7.1 器件支持
      1. 7.1.1 开发支持
        1. 7.1.1.1 引脚复用 (PinMux) 工具
        2. 7.1.1.2 射频工具
        3. 7.1.1.3 Uniflash 闪存编程器
      2. 7.1.2 器件命名规则
    2. 7.2 文档支持
    3. 7.3 社区资源
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  8. 8机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Applications and Implementation

6.1 Application Information

6.1.1 Typical Application – CC3200 Wide-Voltage Mode

Figure 6-1 shows the schematics for an application using the CC3200 wide-voltage mode.

sch_wide_voltage_V0P31_swas032.gifFigure 6-1 Schematics for CC3200 Wide-Voltage Mode Application

Table 6-1 lists the bill of materials for an application using the CC3200 wide-voltage mode.

Table 6-1 Bill of Materials for CC3200 Wide-Voltage Mode Application

Item Qty Part Reference Value Manufacturer Part Number Description
1 3 C1 C2 C3 4.7 µF Samsung Electro-Mechanics America, Inc CL05A475MQ5NRNC Capacitor, Ceramic: 4.7 µF 6.3 V 20% X5R 0402
2 13 C4 C5 C8 C11 C12 C13 C14 C17 C19 C20 C21 C22 C23 0.1 µF Taiyo Yuden LMK105BJ104KV-F Capacitor, Ceramic: 0.1 µF 10 V 10% X5R 0402
3 1 C9 1.0 pF Murata Electronics North America GJM1555C1H1R0BB01D Capacitor, Ceramic: 1 pF 50 V NP0 0402
4 2 C10 C18 10 µF Murata Electronics North America GRM188R60J106ME47D Capacitor, Ceramic: 10 µF 6.3 V 20% X5R 0603
5 2 C15 C16 22 µF Taiyo Yuden AMK107BBJ226MAHT Capacitor, Ceramic: 22 µF 4 V 20% X5R 0603
6 2 C24 C46 10 pF Murata Electronics North America GRM1555C1H100FA01D Capacitor, Ceramic: 10 pF 50 V 1% NP0 0402
7 2 C42 C49 6.2 pF Murata Electronics North America GRM1555C1H6R2BA01D Capacitor, Ceramic: 6.2 pF 50 V NP0 0402
8 1 E2 2.4-GHz Ant Taiyo Yuden AH316M245001-T Chip Antenna: 50 Ω Bluetooth WLAN ZigBee® WIMAX
9 1 FL1 2.4-GHz Filter TDK-Epcos DEA202450BT-1294C1-H Filter, Bandpass: 2.4 GHz WLAN SMD
10 1 L1 3.6 nH Murata Electronics North America LQP15MN3N6B02D Inductor: 3.6 nH 0.1 nH 0402
11 2 L2 L8 2.2 µH Murata Electronics North America LQM2HPN2R2MG0L Inductor: 2.2 µH 20% 1300 mA 1008
12 1 L3 1 µH Murata LQM2HPN1R0MJ0L Inductor, Power: 1.0 µH 1500 mA 1007
16 1 U1 8M
(1M x 8)		 Micron Technology Inc M25PX80-VMN6TP IC Flash: 8Mb 75 MHz 8SO
17 1 U2 CC3200 Texas Instruments CC3200R1-M2RTDR ARM M4 MCU with 802.11bgn WI-FI
18 1 Y1 Crystal Abracon Corporation ABS07-32.768KHZ-T Crystal: 32.768 kHz 12.5 pF SMD
19 1 Y2 Crystal Epson Q24FA20H00396 Crystal: 40 MHz 8 pF SMD

6.1.2 Typical Application – CC3200 Preregulated 1.85-V Mode

Figure 6-2 shows the schematics for an application using the CC3200 preregulated 1.85-V mode.

sch_1P85V_mode_V0P3_swas032.gifFigure 6-2 Schematics for CC3200 Preregulated 1.85-V Mode Application

Table 6-1 lists the bill of materials for an application using the CC3200 preregulated 1.85-V mode.

Table 6-2 Bill of Materials for CC3200 Preregulated 1.85-V Mode Application

Item Qty Part Reference Value Manufacturer Part Number Description
1 3 C1 C2 C3 4.7 µF Samsung Electro-Mechanics America, Inc CL05A475MQ5NRNC Capacitor, Ceramic: 4.7 µF 6.3 V 20% X5R 0402
2 12 C4 C5 C8 C11 C12 C14 C17 C19 C20 C21 C22 C23 0.1 µF Taiyo Yuden LMK105BJ104KV-F Capacitor, Ceramic: 0.1 µF 10 V 10% X5R 0402
3 1 C9 1.0 pF Murata Electronics North America GJM1555C1H1R0BB01D Capacitor, Ceramic: 1 pF 50 V NP0 0402
4 1 C16 22 µF Taiyo Yuden AMK107BBJ226MAHT Capacitor, Ceramic: µF 4 V 20% X5R 0603
5 2 C13 C18 10 µF Murata Electronics North America GRM188R60J106ME47D Capacitor, Ceramic: 10 µF 6.3 V 20% X5R 0603
6 2 C24 C46 10 pF Murata Electronics North America GRM1555C1H100FA01D Capacitor, Ceramic: 10 pF 50 V 1% NP0 0402
7 2 C42 C49 6.2 pF Murata Electronics North America GRM1555C1H6R2BA01D Capacitor, Ceramic: 6.2 pF 50 V NP0 0402
8 1 E2 2.4-GHz Ant Taiyo Yuden AH316M245001-T Antenna, Chip: 50 Ω Bluetooth WLAN ZigBee WIMAX
9 1 FL1 2.4-GHz Filter TDK-Epcos DEA202450BT-1294C1-H Filter, Bandpass: 2.4 GHz WLAN SMD
10 1 L1 3.6 nH Murata Electronics North America LQP15MN3N6B02D Inductor: 3.6 nH 0.1 nH 0402
11 1 L8 2.2 µH Murata Electronics North America LQM2HPN2R2MG0L Inductor: 2.2 µH 20% 1300 mA 1008
15 1 U1 8M
(1M x 8)		 Winbond W25Q80BWZPIG IC FLASH 8Mb 75 MHz 8WSON
16 1 U2 CC3200 Texas Instruments CC3200R1-M2RTDR ARM M4 MCU with 802.11bgn WIFI
17 1 Y1 Crystal Abracon Corporation ABS07-32.768KHZ-T Crystal: 32.768 kHz 12.5 pF SMD
18 1 Y2 Crystal Epson Q24FA20H00396 Crystal: 40 MHz 8 pF SMD
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