ZHCSGZ7E March   2017  – May 2021 CC3220MOD , CC3220MODA

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 功能方框图
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 CC3220MODx and CC3220MODAx Pin Diagram
    2. 7.2 Pin Attributes
      1. 7.2.1 Module Pin Attributes
    3. 7.3 Connections for Unused Pins
    4. 7.4 Pin Attributes and Pin Multiplexing
    5. 7.5 Drive Strength and Reset States for Analog-Digital Multiplexed Pins
    6. 7.6 Pad State After Application of Power to Chip, but Before Reset Release
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Current Consumption (CC3220MODS and CC3220MODAS)
    5. 8.5  Current Consumption (CC3220MODSF and CC3220MODASF)
    6. 8.6  TX Power and IBAT Versus TX Power Level Settings
    7. 8.7  Brownout and Blackout Conditions
    8. 8.8  Electrical Characteristics
    9. 8.9  CC3220MODAx Antenna Characteristics
    10. 8.10 WLAN Receiver Characteristics
    11. 8.11 WLAN Transmitter Characteristics
    12. 8.12 Reset Requirement
    13. 8.13 Thermal Resistance Characteristics for MOB and MON Packages
    14. 8.14 Timing and Switching Characteristics
      1. 8.14.1 Power-Up Sequencing
      2. 8.14.2 Power-Down Sequencing
      3. 8.14.3 Device Reset
      4. 8.14.4 Wake Up From Hibernate Timing
      5. 8.14.5 Peripherals Timing
        1. 8.14.5.1  SPI
          1. 8.14.5.1.1 SPI Master
          2. 8.14.5.1.2 SPI Slave
        2. 8.14.5.2  I2S
          1. 8.14.5.2.1 I2S Transmit Mode
          2. 8.14.5.2.2 I2S Receive Mode
        3. 8.14.5.3  GPIOs
          1. 8.14.5.3.1 GPIO Input Transition Time Parameters
        4. 8.14.5.4  I2C
        5. 8.14.5.5  IEEE 1149.1 JTAG
        6. 8.14.5.6  ADC
        7. 8.14.5.7  Camera Parallel Port
        8. 8.14.5.8  UART
        9. 8.14.5.9  External Flash Interface
        10. 8.14.5.10 SD Host
        11. 8.14.5.11 Timers
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  Arm® Cortex®-M4 处理器内核子系统
    3. 9.3  Wi-Fi® Network Processor Subsystem
      1. 9.3.1 WLAN
      2. 9.3.2 Network Stack
    4. 9.4  Security
    5. 9.5  Power-Management Subsystem
      1. 9.5.1 VBAT Wide-Voltage Connection
    6. 9.6  Low-Power Operating Mode
    7. 9.7  Memory
      1. 9.7.1 Internal Memory
        1. 9.7.1.1 SRAM
        2. 9.7.1.2 ROM
        3. 9.7.1.3 Flash Memory
        4. 9.7.1.4 Memory Map
    8. 9.8  Restoring Factory Default Configuration
    9. 9.9  Boot Modes
      1. 9.9.1 Boot Mode List
    10. 9.10 Device Certification and Qualification
      1. 9.10.1 FCC Certification and Statement
      2. 9.10.2 Industry Canada (IC) Certification and Statement
      3. 9.10.3 ETSI/CE Certification
      4. 9.10.4 MIC Certification
      5. 9.10.5 SRRC Certification and Statement
    11. 9.11 Module Markings
    12. 9.12 End Product Labeling
    13. 9.13 Manual Information to the End User
  10. 10Applications, Implementation, and Layout
    1. 10.1 Typical Application
    2. 10.2 Device Connection and Layout Fundamentals
      1. 10.2.1 Power Supply Decoupling and Bulk Capacitors
      2. 10.2.2 Reset
      3. 10.2.3 Unused Pins
    3. 10.3 PCB Layout Guidelines
      1. 10.3.1 General Layout Recommendations
      2. 10.3.2 CC3220MODx RF Layout Recommendations
        1. 10.3.2.1 Antenna Placement and Routing
        2. 10.3.2.2 Transmission Line Considerations
      3. 10.3.3 CC3220MODAx RF Layout Recommendations
  11. 11Environmental Requirements and Specifications
    1. 11.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 Baking Conditions
    5. 11.5 Soldering and Reflow Condition
  12. 12Device and Documentation Support
    1. 12.1 Development Tools and Software
    2. 12.2 Firmware Updates
    3. 12.3 Device Nomenclature
    4. 12.4 Documentation Support
    5. 12.5 Trademarks
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
      1. 13.2.1 Packaging Information
      2. 13.2.2 Tape and Reel Information
        1. 13.2.2.1 CC3220MODx Tape Specifications
        2. 13.2.2.2 CC3220MODAx Tape Specifications

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • MON|63
散热焊盘机械数据 (封装 | 引脚)

11.5 Soldering and Reflow Condition

  • Heating method: Conventional convection or IR convection
  • Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering portion or equivalent method
  • Solder paste composition: Sn/3.0 Ag/0.5 Cu
  • Allowable reflow soldering times: 2 times based on the reflow soldering profile
    (see Figure 11-1)
  • Temperature profile: Reflow soldering will be done according to the temperature profile (see
    Figure 11-1)
  • Peak temperature: 245°C
GUID-49123E94-0B33-466E-8907-510762CF9E71-low.pngFigure 11-1 Temperature Profile for Evaluation of Solder Heat Resistance of a Component (at Solder Joint)

 

Note:

TI does not recommend the use of conformal coating or similar material on the SimpleLink™ module. This coating can lead to localized stress on the solder connections inside the module and impact the module reliability. Use caution during the module assembly process to the final PCB to avoid the presence of foreign material inside the module.
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