ZHCSOT4B February   2020  – May 2021 CC3230S , CC3230SF

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. 功能方框图
  5. Revision History
  6. Device Comparison
    1. 6.1 Related Products
  7. Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Pin Attributes
      1. 7.2.1 Pin Descriptions
    3. 7.3 Signal Descriptions
      1.      13
    4. 7.4 Pin Multiplexing
    5. 7.5 Drive Strength and Reset States for Analog and Digital Multiplexed Pins
    6. 7.6 Pad State After Application of Power to Device, Before Reset Release
    7. 7.7 Connections for Unused Pins
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Current Consumption Summary (CC3230S)
      1.      24
    6. 8.6  Current Consumption Summary (CC3230SF)
      1.      26
    7. 8.7  TX Power Control
    8. 8.8  Brownout and Blackout Conditions
    9. 8.9  Electrical Characteristics for GPIO Pins
      1. 8.9.1 Electrical Characteristics: GPIO Pins Except 29, 30, 50, 52, and 53
      2. 8.9.2 Electrical Characteristics: GPIO Pins 29, 30, 50, 52, and 53
    10. 8.10 Electrical Characteristics for Pin Internal Pullup and Pulldown
      1.      33
    11. 8.11 WLAN Receiver Characteristics
      1.      35
    12. 8.12 WLAN Transmitter Characteristics
      1.      37
    13. 8.13 WLAN Transmitter Out-of-Band Emissions
      1. 8.13.1 WLAN Filter Requirements
    14. 8.14 BLE/2.4 GHz Radio Coexistence and WLAN Coexistence Requirements
    15. 8.15 Thermal Resistance Characteristics for RGK Package
    16. 8.16 Timing and Switching Characteristics
      1. 8.16.1 Power Supply Sequencing
      2. 8.16.2 Device Reset
      3. 8.16.3 Reset Timing
        1. 8.16.3.1 nRESET (32-kHz Crystal)
        2. 8.16.3.2 First-Time Power-Up and Reset Removal Timing Requirements (32-kHz Crystal)
        3. 8.16.3.3 nRESET (External 32-kHz Clock)
          1. 8.16.3.3.1 First-Time Power-Up and Reset Removal Timing Requirements (External 32-kHz Clock)
      4. 8.16.4 Wakeup From HIBERNATE Mode
      5. 8.16.5 Clock Specifications
        1. 8.16.5.1 Slow Clock Using Internal Oscillator
        2. 8.16.5.2 Slow Clock Using an External Clock
          1. 8.16.5.2.1 External RTC Digital Clock Requirements
        3. 8.16.5.3 Fast Clock (Fref) Using an External Crystal
          1. 8.16.5.3.1 WLAN Fast-Clock Crystal Requirements
        4. 8.16.5.4 Fast Clock (Fref) Using an External Oscillator
          1. 8.16.5.4.1 External Fref Clock Requirements (–40°C to +85°C)
      6. 8.16.6 Peripherals Timing
        1. 8.16.6.1  SPI
          1. 8.16.6.1.1 SPI Master
            1. 8.16.6.1.1.1 SPI Master Timing Parameters
          2. 8.16.6.1.2 SPI Slave
            1. 8.16.6.1.2.1 SPI Slave Timing Parameters
        2. 8.16.6.2  I2S
          1. 8.16.6.2.1 I2S Transmit Mode
            1. 8.16.6.2.1.1 I2S Transmit Mode Timing Parameters
          2. 8.16.6.2.2 I2S Receive Mode
            1. 8.16.6.2.2.1 I2S Receive Mode Timing Parameters
        3. 8.16.6.3  GPIOs
          1. 8.16.6.3.1 GPIO Output Transition Time Parameters (Vsupply = 3.3 V)
            1. 8.16.6.3.1.1 GPIO Output Transition Times (Vsupply = 3.3 V) (1) (1)
          2. 8.16.6.3.2 GPIO Input Transition Time Parameters
            1. 8.16.6.3.2.1 GPIO Input Transition Time Parameters
        4. 8.16.6.4  I2C
          1. 8.16.6.4.1 I2C Timing Parameters (1)
        5. 8.16.6.5  IEEE 1149.1 JTAG
          1. 8.16.6.5.1 JTAG Timing Parameters
        6. 8.16.6.6  ADC
          1. 8.16.6.6.1 ADC Electrical Specifications
        7. 8.16.6.7  Camera Parallel Port
          1. 8.16.6.7.1 Camera Parallel Port Timing Parameters
        8. 8.16.6.8  UART
        9. 8.16.6.9  SD Host
        10. 8.16.6.10 Timers
  9. Detailed Description
    1. 9.1  Overview
    2. 9.2  Arm® Cortex®-M4 Processor Core Subsystem
    3. 9.3  Wi-Fi® Network Processor Subsystem
      1. 9.3.1 WLAN
      2. 9.3.2 Network Stack
    4. 9.4  Security
    5. 9.5  Power-Management Subsystem
    6. 9.6  Low-Power Operating Mode
    7. 9.7  Memory
      1. 9.7.1 External Memory Requirements
      2. 9.7.2 Internal Memory
        1. 9.7.2.1 SRAM
        2. 9.7.2.2 ROM
        3. 9.7.2.3 Flash Memory
        4. 9.7.2.4 Memory Map
    8. 9.8  Restoring Factory Default Configuration
    9. 9.9  Boot Modes
      1. 9.9.1 Boot Mode List
    10. 9.10 Hostless Mode
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 BLE/2.4 GHz Radio Coexistence
      2. 10.1.2 Antenna Selection
      3. 10.1.3 Typical Application
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General PCB Guidelines
      2. 10.2.2 Power Layout and Routing
        1. 10.2.2.1 Design Considerations
      3. 10.2.3 Clock Interface Guidelines
      4. 10.2.4 Digital Input and Output Guidelines
      5. 10.2.5 RF Interface Guidelines
  11. 11Device and Documentation Support
    1. 11.1 第三方米6体育平台手机版_好二三四免责声明
    2. 11.2 Tools and Software
    3. 11.3 Firmware Updates
    4. 11.4 Device Nomenclature
    5. 11.5 Documentation Support
    6. 11.6 支持资源
    7. 11.7 Trademarks
    8. 11.8 静电放电警告
    9. 11.9 术语表
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information
      2. 12.1.2 Tape and Reel Information

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订购信息

Documentation Support

To receive notification of documentation updates—including silicon errata—go to the product folder for your device on ti.com (for example, CC3230S). In the upper right corner, click the "Alert me" button. This registers you to receive a weekly digest of product information that has changed (if any). For change details, check the revision history of any revised document. The current documentation that describes the processor, related peripherals, and other technical collateral follows.

The following documents provide support for the CC3230 device.

 

Application Reports

    SimpleLink™ CC31xx, CC32xx Wi-Fi® Internet-on-a chip™ Solution Built-In Security FeaturesThe SimpleLink Wi-Fi CC31xx and CC32xx Internet-on-a chip family of devices from Texas Instruments offer a wide range of built-in security features to help developers address a variety of security needs, which is achieved without any processing burden on the main microcontroller (MCU). This document describes these security-related features and provides recommendations for leveraging each in the context of practical system implementation.
    Using Serial Flash on SimpleLink™ CC3135 and CC3235 Wi-Fi® and Internet-of-Things DevicesThis application note is divided into two parts. The first part provides important guidelines and best- practice design techniques to consider when choosing and embedding a serial Flash paired with the CC3135 and CC3235 (CC3x35) devices. The second part describes the file system, along with guidelines and considerations for system designers working with the CC3x35 devices.

User's Guides

    SimpleLink™ Wi-Fi® and Internet-of-Things CC31xx and CC32xx Network ProcessorThis document provides software (SW) programmers with all of the required knowledge for working with the networking subsystem of the SimpleLink Wi-Fi devices. This guide provides basic guidelines for writing robust, optimized networking host applications, and describes the capabilities of the networking subsystem. The guide contains some example code snapshots, to give users an idea of how to work with the host driver. More comprehensive code examples can be found in the formal software development kit (SDK). This guide does not provide a detailed description of the host driver APIs.
    SimpleLink™ Wi-Fi® CC3135 and CC3235 and IoT Solution Layout GuidelinesThis document provides the design guidelines of the 4-layer PCB used for the CC3135 and CC3235 SimpleLink Wi-Fi family of devices from Texas Instruments. The CC3135 and CC3235 devices are easy to lay out and are available in quad flat no-leads (QFNS) packages. When designing the board, follow the suggestions in this document to optimize performance of the board.
    SimpleLink™ CC3235 Wi-Fi® LaunchPad™ Development Kit HardwareThe CC3235 SimpleLink LaunchPad Development Kit (LAUNCHXL-CC3235) is a cost-conscious evaluation platform for Arm Cortex-M4-based MCUs. The LaunchPad design highlights the CC3230 Internet-on-a chip solution and Wi-Fi capabilities. The CC3235 LaunchPad also features temperature and accelerometer sensors, programmable user buttons, three LEDs for custom applications, and onboard emulation for debugging. The stackable headers of the CC3235 LaunchPad XL interface demonstrate how easy it is to expand the functionality of the LaunchPad when interfacing with other peripherals on many existing BoosterPack™ Plug-in Module add-on boards, such as graphical displays, audio codecs, antenna selection, environmental sensing, and more.
    SimpleLink™ Wi-Fi® and Internet-on-a chip™ CC3135 and CC3235 Solution Radio ToolThe Radio Tool serves as a control panel for direct access to the radio, and can be used for both the radio frequency (RF) evaluation and for certification purposes. This guide describes how to have the tool work seamlessly on Texas Instruments evaluation platforms such as the BoosterPack™ plus FTDI emulation board for CC3230 devices, and the LaunchPad™ for CC3230 devices.

More Literature

    CC3235 SimpleLink™ Wi-Fi® and Internet of Things Technical Reference Manual This technical reference manual details the modules and peripherals of the CC3230 SimpleLink™ Wi-Fi® MCU. Each description presents the module or peripheral in a general sense. Not all features and functions of all modules or peripherals may be present on all devices. Pin functions, internal signal connections, and operational parameters differ from device to device. The user should consult the device-specific data sheet for these details.