ZHCSOT4C February   2020  – December 2024 CC3230S , CC3230SF

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 功能方框图
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagram
    2. 6.2 Pin Attributes
      1. 6.2.1 Pin Descriptions
    3. 6.3 Signal Descriptions
      1.      13
    4. 6.4 Pin Multiplexing
    5. 6.5 Drive Strength and Reset States for Analog and Digital Multiplexed Pins
    6. 6.6 Pad State After Application of Power to Device, Before Reset Release
    7. 6.7 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Current Consumption Summary (CC3230S)
      1.      24
    6. 7.6  Current Consumption Summary (CC3230SF)
      1.      26
    7. 7.7  TX Power Control
    8. 7.8  Brownout and Blackout Conditions
    9. 7.9  Electrical Characteristics for GPIO Pins
      1. 7.9.1 Electrical Characteristics: GPIO Pins Except 29, 30, 50, 52, and 53
      2. 7.9.2 Electrical Characteristics: GPIO Pins 29, 30, 50, 52, and 53
    10. 7.10 Electrical Characteristics for Pin Internal Pullup and Pulldown
      1.      33
    11. 7.11 WLAN Receiver Characteristics
      1.      35
    12. 7.12 WLAN Transmitter Characteristics
      1.      37
    13. 7.13 WLAN Transmitter Out-of-Band Emissions
      1. 7.13.1 WLAN Filter Requirements
    14. 7.14 BLE/2.4 GHz Radio Coexistence and WLAN Coexistence Requirements
    15. 7.15 Thermal Resistance Characteristics for RGK Package
    16. 7.16 Timing and Switching Characteristics
      1. 7.16.1 Power Supply Sequencing
      2. 7.16.2 Device Reset
      3. 7.16.3 Reset Timing
        1. 7.16.3.1 nRESET (32-kHz Crystal)
        2. 7.16.3.2 First-Time Power-Up and Reset Removal Timing Requirements (32-kHz Crystal)
        3. 7.16.3.3 nRESET (External 32-kHz Clock)
          1. 7.16.3.3.1 First-Time Power-Up and Reset Removal Timing Requirements (External 32-kHz Clock)
      4. 7.16.4 Wakeup From HIBERNATE Mode
      5. 7.16.5 Clock Specifications
        1. 7.16.5.1 Slow Clock Using Internal Oscillator
        2. 7.16.5.2 Slow Clock Using an External Clock
          1. 7.16.5.2.1 External RTC Digital Clock Requirements
        3. 7.16.5.3 Fast Clock (Fref) Using an External Crystal
          1. 7.16.5.3.1 WLAN Fast-Clock Crystal Requirements
        4. 7.16.5.4 Fast Clock (Fref) Using an External Oscillator
          1. 7.16.5.4.1 External Fref Clock Requirements (–40°C to +85°C)
      6. 7.16.6 Peripherals Timing
        1. 7.16.6.1  SPI
          1. 7.16.6.1.1 SPI Master
            1. 7.16.6.1.1.1 SPI Master Timing Parameters
          2. 7.16.6.1.2 SPI Slave
            1. 7.16.6.1.2.1 SPI Slave Timing Parameters
        2. 7.16.6.2  I2S
          1. 7.16.6.2.1 I2S Transmit Mode
            1. 7.16.6.2.1.1 I2S Transmit Mode Timing Parameters
          2. 7.16.6.2.2 I2S Receive Mode
            1. 7.16.6.2.2.1 I2S Receive Mode Timing Parameters
        3. 7.16.6.3  GPIOs
          1. 7.16.6.3.1 GPIO Output Transition Time Parameters (Vsupply = 3.3 V)
            1. 7.16.6.3.1.1 GPIO Output Transition Times (Vsupply = 3.3 V) #GUID-761098ED-1DAD-4953-A730-5C228F39851B/SWAS03298470_ #GUID-761098ED-1DAD-4953-A730-5C228F39851B/SWAS0326310_
          2. 7.16.6.3.2 GPIO Input Transition Time Parameters
            1. 7.16.6.3.2.1 GPIO Input Transition Time Parameters
        4. 7.16.6.4  I2C
          1. 7.16.6.4.1 I2C Timing Parameters #GUID-45C79838-2E6C-4512-90E1-ED14EE3F93C2/SWAS0313060
        5. 7.16.6.5  IEEE 1149.1 JTAG
          1. 7.16.6.5.1 JTAG Timing Parameters
        6. 7.16.6.6  ADC
          1. 7.16.6.6.1 ADC Electrical Specifications
        7. 7.16.6.7  Camera Parallel Port
          1. 7.16.6.7.1 Camera Parallel Port Timing Parameters
        8. 7.16.6.8  UART
        9. 7.16.6.9  SD Host
        10. 7.16.6.10 Timers
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  Arm® Cortex®-M4 Processor Core Subsystem
    3. 8.3  Wi-Fi® Network Processor Subsystem
      1. 8.3.1 WLAN
      2. 8.3.2 Network Stack
    4. 8.4  Security
    5. 8.5  Power-Management Subsystem
    6. 8.6  Low-Power Operating Mode
    7. 8.7  Memory
      1. 8.7.1 External Memory Requirements
      2. 8.7.2 Internal Memory
        1. 8.7.2.1 SRAM
        2. 8.7.2.2 ROM
        3. 8.7.2.3 Flash Memory
        4. 8.7.2.4 Memory Map
    8. 8.8  Restoring Factory Default Configuration
    9. 8.9  Boot Modes
      1. 8.9.1 Boot Mode List
    10. 8.10 Hostless Mode
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Application Information
      1. 9.1.1 BLE/2.4 GHz Radio Coexistence
      2. 9.1.2 Antenna Selection
      3. 9.1.3 Typical Application
    2. 9.2 PCB Layout Guidelines
      1. 9.2.1 General PCB Guidelines
      2. 9.2.2 Power Layout and Routing
        1. 9.2.2.1 Design Considerations
      3. 9.2.3 Clock Interface Guidelines
      4. 9.2.4 Digital Input and Output Guidelines
      5. 9.2.5 RF Interface Guidelines
  11. 10Device and Documentation Support
    1. 10.1 第三方米6体育平台手机版_好二三四免责声明
    2. 10.2 Tools and Software
    3. 10.3 Firmware Updates
    4. 10.4 Device Nomenclature
    5. 10.5 Documentation Support
    6. 10.6 支持资源
    7. 10.7 Trademarks
    8. 10.8 静电放电警告
    9. 10.9 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information
      2. 12.1.2 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Device Comparison

Table 5-1 lists the features supported across different CC3x3x devices.

Table 5-1 Comparison of Device Features
FEATUREDEVICE
CC3130CC3135CC3230SCC3230SFCC3235SCC3235SF
ClassificationNetwork ProcessorNetwork ProcessorWireless microcontrollerWireless microcontrollerWireless microcontrollerWireless microcontroller
Standard802.11b/g/n802.11a/b/g/n802.11b/g/n802.11b/g/n802.11a/b/g/n802.11a/b/g/n
TCP/IP stackIPv4, IPv6IPv4, IPv6IPv4, IPv6IPv4, IPv6IPv4, IPv6IPv4, IPv6
Sockets161616161616
Package9mm × 9mm VQFN9mm × 9mm VQFN9mm × 9mm VQFN9mm × 9mm VQFN9mm × 9mm VQFN9mm × 9mm VQFN
ON-CHIP APPLICATION MEMORY
Flash———1MB—1MB
RAM——256KB256KB256KB256KB
RF FEATURES
Frequency2.4GHz2.4GHz, 5GHz2.4GHz2.4GHz2.4GHz, 5GHz2.4GHz, 5GHz
Coexistence with BLE RadioYesYesYesYesYesYes
SECURITY FEATURES
Secure boot——YesYesYesYes
FIPS 140-2 Level 1 Certification(1)NoYesNoNoYesYes
Enhanced application level security

File system security

Secure key storage

Software tamper detection

Cloning protection

Initial secure programming

File system security

Secure key storage

Software tamper detection

Cloning protection

Initial secure programming

File system security

Secure key storage

Software tamper detection

Cloning protection

Initial secure programming

File system security

Secure key storage

Software tamper detection

Cloning protection

Initial secure programming

File system security

Secure key storage

Software tamper detection

Cloning protection

Initial secure programming

File system security

Secure key storage

Software tamper detection

Cloning protection

Initial secure programming

Wi-Fi level of security

(1)

WEP, WPS, WPA / WPA2 PSK, WPA2 (802.1x), WPA3 personal and enterprise
Additional networking securityUnique device identity
Trusted root-certificate catalog
TI Root-of-trust public key
Online certificate status protocol (OCSP)
Certificate signing request (CSR)
Unique per-device key pair
Hardware accelerationHardware crypto engines
(1) For exact status of FIPS certification for a specific part number, please refer to https://csrc.nist.gov/publications/fips.
(1) When using WPA Enterprise security modes, the TLS socket used to communicate with the Radius server is limited to TLSv1.0.
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