ZHCSKT8B February   2020  – May 2021 CC3235MODAS , CC3235MODASF , CC3235MODS , CC3235MODSF

PRODUCTION DATA  

1. 1 特性
2. 2 应用
3. 3 描述
4. 4 功能方框图
5. 5 Revision History
6. 6 Device Comparison
   1. 6.1 Related Products
7. 7 Terminal Configuration and Functions
   1. 7.1 CC3235MODx and CC3235MODAx Pin Diagram
   2. 7.2 Pin Attributes and Pin Multiplexing
      1. 7.2.1 Module Pin Descriptions
   3. 7.3 Signal Descriptions
   4. 7.4 Drive Strength and Reset States for Analog-Digital Multiplexed Pins
   5. 7.5 Pad State After Application of Power to Chip, but Before Reset Release
   6. 7.6 Connections for Unused Pins
8. 8 Specifications
   1. 8.1  Absolute Maximum Ratings
   2. 8.2  ESD Ratings
   3. 8.3  Recommended Operating Conditions
   4. 8.4  Current Consumption (CC3235MODS and CC3235MODAS)
      1.      21
      2.      22
   5. 8.5  Current Consumption (CC3235MODSF and CC3235MODASF)
      1.      24
      2.      25
   6. 8.6  TX Power Control for 2.4 GHz Band
   7. 8.7  TX Power Control for 5 GHz
   8. 8.8  Brownout and Blackout Conditions
   9. 8.9  Electrical Characteristics for GPIO Pins
      1. 8.9.1 Electrical Characteristics for Pin Internal Pullup and Pulldown (25°C)
   10. 8.10 CC3235MODAx Antenna Characteristics
   11. 8.11 WLAN Receiver Characteristics
       1.      33
       2.      34
   12. 8.12 WLAN Transmitter Characteristics
       1.      36
       2.      37
   13. 8.13 BLE and WLAN Coexistence Requirements
   14. 8.14 Reset Requirement
   15. 8.15 Thermal Resistance Characteristics for MOB and MON Packages
   16. 8.16 Timing and Switching Characteristics
       1. 8.16.1 Power-Up Sequencing
       2. 8.16.2 Power-Down Sequencing
       3. 8.16.3 Device Reset
       4. 8.16.4 Wake Up From Hibernate Timing
       5. 8.16.5 Peripherals Timing
          1. 8.16.5.1  SPI
             1. 8.16.5.1.1 SPI Master
             2. 8.16.5.1.2 SPI Slave
          2. 8.16.5.2  I2S
             1. 8.16.5.2.1 I2S Transmit Mode
             2. 8.16.5.2.2 I2S Receive Mode
          3. 8.16.5.3  GPIOs
             1. 8.16.5.3.1 GPIO Input Transition Time Parameters
          4. 8.16.5.4  I2C
          5. 8.16.5.5  IEEE 1149.1 JTAG
          6. 8.16.5.6  ADC
          7. 8.16.5.7  Camera Parallel Port
          8. 8.16.5.8  UART
          9. 8.16.5.9  External Flash Interface
          10. 8.16.5.10 SD Host
          11. 8.16.5.11 Timers
9. 9 Detailed Description
   1. 9.1  Overview
   2. 9.2  Functional Block Diagram
   3. 9.3  Arm Cortex-M4 Processor Core Subsystem
   4. 9.4  Wi-Fi Network Processor Subsystem
      1. 9.4.1 WLAN
      2. 9.4.2 Network Stack
   5. 9.5  Security
   6. 9.6  FIPS 140-2 Level 1 Certification
   7. 9.7  Power-Management Subsystem
      1. 9.7.1 VBAT Wide-Voltage Connection
   8. 9.8  Low-Power Operating Mode
   9. 9.9  Memory
      1. 9.9.1 Internal Memory
         1. 9.9.1.1 SRAM
         2. 9.9.1.2 ROM
         3. 9.9.1.3 Flash Memory
         4. 9.9.1.4 Memory Map
   10. 9.10 Restoring Factory Default Configuration
   11. 9.11 Boot Modes
       1. 9.11.1 Boot Mode List
   12. 9.12 Hostless Mode
   13. 9.13 Device Certification and Qualification
       1. 9.13.1 FCC Certification and Statement
       2. 9.13.2 IC/ISED Certification and Statement
       3. 9.13.3 ETSI/CE Certification
       4. 9.13.4 MIC Certification
   14. 9.14 Module Markings
   15. 9.15 End Product Labeling
   16. 9.16 Manual Information to the End User
10. 10Applications, Implementation, and Layout
    1. 10.1 Typical Application
       1. 10.1.1 BLE/2.4 GHz Radio Coexistence
       2. 10.1.2 Antenna Selection (CC3235MODx only)
       3. 10.1.3 Typical Application Schematic (CC3235MODx)
       4. 10.1.4 Typical Application Schematic (CC3235MODAx)
    2. 10.2 Device Connection and Layout Fundamentals
       1. 10.2.1 Power Supply Decoupling and Bulk Capacitors
       2. 10.2.2 Reset
       3. 10.2.3 Unused Pins
    3. 10.3 PCB Layout Guidelines
       1. 10.3.1 General Layout Recommendations
       2. 10.3.2 CC3235MODx RF Layout Recommendations
          1. 10.3.2.1 Antenna Placement and Routing
          2. 10.3.2.2 Transmission Line Considerations
       3. 10.3.3 CC3235MODAx RF Layout Recommendations
11. 11Environmental Requirements and SMT Specifications
    1. 11.1 PCB Bending
    2. 11.2 Handling Environment
       1. 11.2.1 Terminals
       2. 11.2.2 Falling
    3. 11.3 Storage Condition
       1. 11.3.1 Moisture Barrier Bag Before Opened
       2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 PCB Assembly Guide
       1. 11.4.1 PCB Land Pattern & Thermal Vias
       2. 11.4.2 SMT Assembly Recommendations
       3. 11.4.3 PCB Surface Finish Requirements
       4. 11.4.4 Solder Stencil
       5. 11.4.5 Package Placement
       6. 11.4.6 Solder Joint Inspection
       7. 11.4.7 Rework and Replacement
       8. 11.4.8 Solder Joint Voiding
    5. 11.5 Baking Conditions
    6. 11.6 Soldering and Reflow Condition
12. 12Device and Documentation Support
    1. 12.1 Development Tools and Software
    2. 12.2 Firmware Updates
    3. 12.3 Device Nomenclature
    4. 12.4 Documentation Support
    5. 12.5 Related Links
    6. 12.6 支持资源
    7. 12.7 Trademarks
    8. 12.8 Electrostatic Discharge Caution
    9. 12.9 Glossary
13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
       1. 13.2.1 Packaging Information
       2. 13.2.2 Tape and Reel Information
       3. 13.2.3 CC3235MODx Tape Specifications
       4. 13.2.4 CC3235MODAx Tape Specifications