ZHCSJC1D April   2019  – May 2021 CC3235S , CC3235SF

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 功能方框图
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Pin Attributes
      1.      11
    3. 7.3 Signal Descriptions
      1.      13
    4. 7.4 Pin Multiplexing
    5. 7.5 Drive Strength and Reset States for Analog and Digital Multiplexed Pins
    6. 7.6 Pad State After Application of Power to Device, Before Reset Release
    7. 7.7 Connections for Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Current Consumption Summary (CC3235S)
      1.      24
      2.      25
    6. 8.6  Current Consumption Summary (CC3235SF)
      1.      27
      2.      28
    7. 8.7  TX Power Control for 2.4 GHz Band
    8. 8.8  TX Power Control for 5 GHz
    9. 8.9  Brownout and Blackout Conditions
    10. 8.10 Electrical Characteristics for GPIO Pins
      1.      33
      2.      34
    11. 8.11 Electrical Characteristics for Pin Internal Pullup and Pulldown
    12. 8.12 WLAN Receiver Characteristics
      1.      37
      2.      38
    13. 8.13 WLAN Transmitter Characteristics
      1.      40
      2.      41
    14. 8.14 WLAN Transmitter Out-of-Band Emissions
      1.      43
      2.      44
    15. 8.15 BLE/2.4 GHz Radio Coexistence and WLAN Coexistence Requirements
    16. 8.16 Thermal Resistance Characteristics for RGK Package
    17. 8.17 Timing and Switching Characteristics
      1. 8.17.1 Power Supply Sequencing
      2. 8.17.2 Device Reset
      3. 8.17.3 Reset Timing
        1. 8.17.3.1 nRESET (32-kHz Crystal)
        2.       52
        3.       53
        4. 8.17.3.2 nRESET (External 32-kHz Clock)
          1.        55
      4. 8.17.4 Wakeup From HIBERNATE Mode
      5. 8.17.5 Clock Specifications
        1. 8.17.5.1 Slow Clock Using Internal Oscillator
        2. 8.17.5.2 Slow Clock Using an External Clock
          1.        60
        3. 8.17.5.3 Fast Clock (Fref) Using an External Crystal
          1.        62
        4. 8.17.5.4 Fast Clock (Fref) Using an External Oscillator
          1.        64
      6. 8.17.6 Peripherals Timing
        1. 8.17.6.1  SPI
          1. 8.17.6.1.1 SPI Master
            1.         68
          2. 8.17.6.1.2 SPI Slave
            1.         70
        2. 8.17.6.2  I2S
          1. 8.17.6.2.1 I2S Transmit Mode
            1.         73
          2. 8.17.6.2.2 I2S Receive Mode
            1.         75
        3. 8.17.6.3  GPIOs
          1. 8.17.6.3.1 GPIO Output Transition Time Parameters (Vsupply = 3.3 V)
            1.         78
          2. 8.17.6.3.2 GPIO Input Transition Time Parameters
            1.         80
        4. 8.17.6.4  I2C
          1.        82
        5. 8.17.6.5  IEEE 1149.1 JTAG
          1.        84
        6. 8.17.6.6  ADC
          1.        86
        7. 8.17.6.7  Camera Parallel Port
          1.        88
        8. 8.17.6.8  UART
        9. 8.17.6.9  SD Host
        10. 8.17.6.10 Timers
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  Arm® Cortex®-M4 Processor Core Subsystem
    3. 9.3  Wi-Fi® Network Processor Subsystem
      1. 9.3.1 WLAN
      2. 9.3.2 Network Stack
    4. 9.4  Security
    5. 9.5  FIPS 140-2 Level 1 Certification
    6. 9.6  Power-Management Subsystem
    7. 9.7  Low-Power Operating Mode
    8. 9.8  Memory
      1. 9.8.1 External Memory Requirements
      2. 9.8.2 Internal Memory
        1. 9.8.2.1 SRAM
        2. 9.8.2.2 ROM
        3. 9.8.2.3 Flash Memory
        4. 9.8.2.4 Memory Map
    9. 9.9  Restoring Factory Default Configuration
    10. 9.10 Boot Modes
      1. 9.10.1 Boot Mode List
    11. 9.11 Hostless Mode
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 BLE/2.4 GHz Radio Coexistence
      2. 10.1.2 Antenna Selection
      3. 10.1.3 Typical Application
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General PCB Guidelines
      2. 10.2.2 Power Layout and Routing
        1. 10.2.2.1 Design Considerations
      3. 10.2.3 Clock Interface Guidelines
      4. 10.2.4 Digital Input and Output Guidelines
      5. 10.2.5 RF Interface Guidelines
  11. 11Device and Documentation Support
    1. 11.1  第三方米6体育平台手机版_好二三四免责声明
    2. 11.2  Tools and Software
    3. 11.3  Firmware Updates
    4. 11.4  Device Nomenclature
    5. 11.5  Documentation Support
    6. 11.6  Related Links
    7. 11.7  支持资源
    8. 11.8  Trademarks
    9. 11.9  静电放电警告
    10. 11.10 Export Control Notice
    11. 11.11 术语表
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information
      1. 12.1.1 Package Option Addendum
        1. 12.1.1.1 Packaging Information
        2. 12.1.1.2 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.8.1 External Memory Requirements

The CC3235x device maintains a proprietary file system on the serial flash. The CC3235x file system stores the MCU binary, service pack file, system files, configuration files, certificate files, web page files, and user files. By using a format command through the API, users can provide the total size allocated for the file system. The starting address of the file system cannot be set and is always at the beginning of the serial flash. The applications microcontroller must access the serial flash memory area allocated to the file system directly through the CC3235x file system. The applications microcontroller must not access the serial flash memory area directly.

The file system manages the allocation of serial flash blocks for stored files according to download order, which means that the location of a specific file is not fixed in all systems. Files are stored on serial flash using human-readable filenames rather than file IDs. The file system API works using plain text, and file encryption and decryption is invisible to the user. Encrypted files can be accessed only through the file system.

All file types can have a maximum of 100 supported files in the file system. All files are stored in 4-KB blocks and thus use a minimum of 4KB of flash space. Fail-safe files require twice the original size and use a minimum of 8KB. Encrypted files are counted as fail-safe in terms of space. The maximum file size is 1MB.

Table 9-4 lists the minimum required memory consumption under the following assumptions:

  • System files in use consume 64 blocks (256KB).
  • Vendor files are not taken into account.
  • MCU code is taken as the maximal possible size for the CC3235 with fail-safe enabled to account for future updates, such as through OTA.
  • Gang image:
    • Storage for the gang image is rounded up to 32 blocks (meaning 128-KB resolution).
    • Gang image size depends on the actual content size of all components. Additionally, the image should be 128KB aligned so unaligned memory is considered lost. Service pack, system files, and the 128KB aligned memory are assumed to occupy 256KB.
  • All calculations consider that the restore-to-default is enabled.

Table 9-4 Recommended Flash Size
ITEMCC3235S (KB)CC3235SF (KB)
File system allocation table2020
System and configuration files(1)256256
Service pack(1)264264
MCU Code(1)5122048
Gang image size256 + MCU256 + MCU
Total1308 + MCU2844 + MCU
Minimal flash size(2)16 MBit32 MBit
Recommended flash size(2)16 MBit32 MBit
(1) Including fail-safe.
(2) For maximum MCU size.

 

Note:

The maximum supported serial flash size is 32MB (256Mb) (see Using Serial Flash on CC3135/CC3235 SimpleLink™ Wi-Fi® and Internet-of-Things Devices).
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