米6体育平台手机版

ZHCSLH5K August 1998 – June 2020 CD4049UB , CD4050B

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		CD4049UB					CD4050B					UNIT
		D (SOIC)	DW (SOIC)	E (PDIP)	NS (SO)	PW (TSSOP)	D (SOIC)	DW (SOIC)	E (PDIP)	NS (SO)	PW (TSSOP)
		16 PINS	16 PINS	16 PINS	16 PINS	16 PINS	16 PINS	16 PINS	16 PINS	16 PINS	16 PINS
R_θJA	Junction-to-ambient thermal resistance⁽²⁾	81.6	81.6	49.5	84.3	108.9	81.6	81.2	49.7	83.8	108.4	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	41.5	44.5	36.8	43	43.7	41.5	44.1	37	42.5	43.2	°C/W
R_θJB	Junction-to-board thermal resistance	39	46.3	29.4	44.6	54	39	45.9	29.6	44.1	53.5	°C/W
ψ_JT	Junction-to-top characterization parameter	10.7	16.5	21.7	12.8	4.6	10.7	16.1	21.9	12.5	4.5	°C/W
ψ_JB	Junction-to-board characterization parameter	38.7	45.8	29.3	44.3	53.4	38.7	45.4	29.5	43.8	52.9	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

(2) The package thermal impedance is calculated in accordance with JESD 51-7.