米6体育平台手机版

ZHCSKT0J November 1998 – August 2024 CD4066B

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

5.4 Thermal Information

THERMAL METRIC⁽¹⁾		CD406x				UNIT
		N (PDIP)	D (SOIC)	NS (SO)	PW (TSSOP)
		14 PINS	14 PINS	14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	93.7	109.7	112.4	101.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	72.5	69.4	70.4	44.3	°C/W
R_θJB	Junction-to-board thermal resistance	68.0	67.9	76.4	68.2	°C/W
Ψ_JT	Junction-to-top characterization parameter	50.3	25.8	28.9	3.2	°C/W
Ψ_JB	Junction-to-board characterization parameter	67.3	67.1	75.4	67.6	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.