ZHCSN66D january 1998 – january 2021 CD54HC00 , CD74HC00
PRODUCTION DATA
| THERMAL METRIC(1) | CD74HC00 | UNIT | ||
|---|---|---|---|---|
| N (PDIP) | D (SOIC) | |||
| 14 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 69.5 | 133.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 57.6 | 89.0 | °C/W |
| RθJB | Junction-to-board thermal resistance | 49.3 | 89.5 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 37.6 | 45.5 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 49.1 | 89.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |