ZHCSPL0C February 1998 – December 2021 CD54HC273 , CD54HCT273 , CD74HC273 , CD74HCT273
PRODUCTION DATA
| THERMAL METRIC | SN74HC(T)273 | UNIT | ||
|---|---|---|---|---|
| DW (SOIC) | N (PDIP) | |||
| 20 PINS | 20 PINS | |||
| RθJA | Junction-to-ambient thermal resistance(1) | 109.1 | 84.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 76 | 72.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 77.6 | 65.3 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 51.5 | 55.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 77.1 | 65.2 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |