米6体育平台手机版

ZHCSRI3E August 1997 – April 2021 CD54HC30 , CD74HC30

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		CD74HC30				UNIT
		N (PDIP)	D (SOIC)	NS (SOP)	PW (TSSOP)
		14 PINS	14 PINS	14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	65.1	133.6	122.6	151.7	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	52.9	89.0	81.8	79.4	°C/W
R_θJB	Junction-to-board thermal resistance	44.9	89.5	83.8	94.7	°C/W
Ψ_JT	Junction-to-top characterization parameter	32.4	45.5	45.4	25.2	°C/W
Ψ_JB	Junction-to-board characterization parameter	44.6	89.1	83.4	94.1	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.