ZHCSJS2N November   1997  – April 2024 CD54HC4051 , CD54HC4052 , CD54HC4053 , CD54HCT4051 , CD74HC4051 , CD74HC4052 , CD74HC4053 , CD74HCT4051 , CD74HCT4052 , CD74HCT4053

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Thermal Information
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Electrical Characteristics: HC Devices
    6. 5.6  Electrical Characteristics: HCT Devices
    7. 5.7  Switching Characteristics, VCC = 5V
    8. 5.8  Switching Characteristics, CL = 50pF
    9. 5.9  Analog Channel Specifications
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • J|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.3 Thermal Information

THERMAL METRIC(1) CD74HC4051 UNIT
N (PDIP) NS (SO) PW (TSSOP)
16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance  77.3 99.3 116.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 56.2 59.6 51.9 °C/W
RθJB Junction-to-board thermal resistance 52.6 65.7 73.9 °C/W
ΨJT Junction-to-top characterization parameter 33.7 21.5 4.7 °C/W
ΨJB Junction-to-board characterization parameter 52.1 65.1 73.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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