米6体育平台手机版

ZHCSO56E January 1998 – May 2021 CD54HC74 , CD74HC74

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

6.3 Thermal Information

THERMAL METRIC⁽¹⁾		CD74HC74		UNIT
		N (PDIP)	D (SOIC)
		14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	62.2	133.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	49.9	89.0	°C/W
R_θJB	Junction-to-board thermal resistance	41.9	89.5	°C/W
Ψ_JT	Junction-to-top characterization parameter	29.5	45.5	°C/W
Ψ_JB	Junction-to-board characterization parameter	41.7	89.1	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.