米6体育平台手机版

ZHCSOB7 August 2019 – June 2021 CD54HCT14 , CD74HCT14

PRODUCTION DATA

6.3 Thermal Information

THERMAL METRIC⁽¹⁾		CD74HCT14			UNIT
		N (PDIP)	D (SOIC)	PW (TSSOP)
		14 PINS	14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	62.9	95.5	119.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	50.7	49.9	42.5	°C/W
R_θJB	Junction-to-board thermal resistance	42.7	51.7	64.5	°C/W
Ψ_JT	Junction-to-top characterization parameter	30.3	12.8	4.5	°C/W
Ψ_JB	Junction-to-board characterization parameter	42.4	51.3	63.7	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.