米6体育平台手机版

ZHCSQV5B November 1998 – July 2022 CD54HC245 , CD54HCT245 , CD74HC245 , CD74HCT245

PRODUCTION DATA

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

J|20

散热焊盘机械数据 (封装 | 引脚)

订购信息

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

			MIN	MAX	UNIT
V_CC	Supply voltage		-0.5	7	V
I_IK	Input diode current	For V_I < -0.5V or V_I > V_CC + 0.5V		±20	mA
I_OK	Output diode current	For V_O < -0.5V or V_O > V_CC + 0.5V		±20	mA
I_O	Drain current, per output	For -0.5V < V_O < V_CC + 0.5V		±35	mA
I_O	Output source or sink current per output pin	For V_O > -0.5V or V_O < V_CC + 0.5V		±25	mA
	Continuous current through V_CC or GND			±50	mA
T_J	Junction temperature			150	°C
T_stg	Storage temperature range		-65	150	°C
	Lead temperature (Soldering 10s)(SOIC - lead tips only)			300	°C

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.