ZHCSW40B February 2003 – July 2024 CD74AC238
PRODUCTION DATA
- 1
- 1 特性
- 2 说明
- 3 Pin Configuration and Functions
-
4 Specifications
- 4.1 Absolute Maximum Ratings
- 4.2 ESD Ratings
- 4.3 Recommended Operating Conditions
- 4.4 Thermal Information
- 4.5 Electrical Characteristics
- 4.6 Switching Characteristics, VCC = 1.5 V
- 4.7 Switching Characteristics, VCC = 3.3 V ± 0.3 V
- 4.8 Switching Characteristics, VCC = 5 V ± 0.5 V
- 4.9 Operating Characteristics
- 5 Parameter Measurement Information
- 6 Detailed Description
- 7 Application Information
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
- BQB|16
- PW|16
- D|16
散热焊盘机械数据 (封装 | 引脚)
- BQB|16
订购信息
3 Pin Configuration and Functions
Figure 3-1 CD74AC238 D or PW Package; 16-Pin SOIC or TSSOP (Top View)
Figure 3-2 CD74AC238 BQB Package, 16-Pin WQFN (Top
View)Table 3-1 Pin Functions
| PIN | TYPE(1) | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| A | 1 | I | Input A |
| B | 2 | I | Input B |
| C | 3 | I | Input C |
| G2A | 4 | I | Strobe Input 2A, active low |
| G2B | 5 | I | Strobe Input 2B, active low |
| G1 | 6 | I | Strobe Input |
| Y7 | 7 | O | Output 7 |
| GND | 8 | G | Ground |
| Y6 | 9 | O | Output 6 |
| Y5 | 10 | O | Output 5 |
| Y4 | 11 | O | Output 4 |
| Y3 | 12 | O | Output 3 |
| Y2 | 13 | O | Output 2 |
| Y1 | 14 | O | Output 1 |
| Y0 | 15 | O | Output 0 |
| VCC | 16 | P | Positive Supply |
| Thermal Pad(2) | — | Thermal Pad | |
(1) I = Input, O = Output, I/O = Input or Output, G = Ground, P =
Power.
(2) BQB package only