ZHCSWZ9A August   1998  – August 2024 CD74AC251

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 说明
  4. Pin Configuration and Functions
  5. Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Recommended Operating Conditions
    3. 4.3 Thermal Information
    4. 4.4 Electrical Characteristics
    5. 4.5 Switching Characteristics
  6. Parameter Measurement Information
  7. Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
  9. Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Links
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|16
散热焊盘机械数据 (封装 | 引脚)

Pin Configuration and Functions

CD74AC251 CD74AC251 D Package, 16-Pin SOIC (Top View) Figure 3-1 CD74AC251 D Package, 16-Pin SOIC (Top View)
PIN TYPE1 DESCRIPTION
NAME NO.
I3 1 I Input 3
I2 2 I Input 2
I1 3 I Input 1
I0 4 I Input 0
Y 5 I Output
Y 6 I Inverted Output
OE 7 O Output Enable
GND 8 G Ground
S2 9 O Input Select 2
S1 10 O Input Select 1
S0 11 O Input Select 0
I7 12 O Input 7
I6 13 O Input 6
I5 14 O Input 5
I4 15 O Input 4
VCC 16 P Positive Supply
  1. Signal Types: I = Input, O = Output, I/O = Input or Output.