米6体育平台手机版

ZHCSRI1F August 1997 – April 2021 CD54HC04 , CD74HC04

PRODUCTION DATA

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

D|14
N|14

散热焊盘机械数据 (封装 | 引脚)

订购信息

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

			MIN	MAX	UNIT
V_CC	Supply voltage		–0.5	7	V
I_IK	Input clamp current⁽²⁾	V_I < –0.5 V or V_I > V_CC + 0.5 V		±20	mA
I_OK	Output clamp current⁽²⁾	V_O < –0.5 V or V_O > V_CC + 0.5 V		±20	mA
I_O	Continuous output current	V_O > –0.5 V or V_O < V_CC + 0.5 V		±25	mA
	Continuous current through V_CC or GND			±50	mA
T_J	Junction temperature⁽³⁾	Plastic package		150	°C
T_J	Junction temperature⁽³⁾	Hermetic package or die		175	°C
	Lead temperature (soldering 10s)	SOIC - lead tips only		300	°C
T_stg	Storage temperature		–65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

(3) Guaranteed by design.