ZHCSL32B July 2003 – April 2020 CD74HC08-Q1
PRODUCTION DATA.
| THERMAL METRIC | CD74HC08-Q1 | UNIT | |
|---|---|---|---|
| D (SOIC) | |||
| 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 133.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 89.0 | °C/W |
| RθJB | Junction-to-board thermal resistance | 89.5 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 45.5 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 89.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |