ZHCSRI2D August 1997 – April 2021 CD54HC08 , CD74HC08
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
THERMAL METRIC(1) | CD74HC30 | UNIT | ||||
---|---|---|---|---|---|---|
N (PDIP) | D (SOIC) | PW (TSSOP) | NS (SOP) | |||
14 PINS | 14 PINS | 14 PINS | 14 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 65.1 | 133.6 | 151.7 | 122.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 52.9 | 89.0 | 79.4 | 81.8 | °C/W |
RθJB | Junction-to-board thermal resistance | 44.9 | 89.5 | 94.7 | 83.8 | °C/W |
ΨJT | Junction-to-top characterization parameter | 32.4 | 45.5 | 25.2 | 45.4 | °C/W |
ΨJB | Junction-to-board characterization parameter | 44.6 | 89.1 | 94.1 | 83.4 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | N/A | °C/W |