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ZHCSRI8D November 1997 – April 2021 CD54HC125 , CD74HC125

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		CD74HC125		UNIT
		N (PDIP)	D (SOIC)
		14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	62.7	133.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	50.5	89.0	°C/W
R_θJB	Junction-to-board thermal resistance	42.4	89.5	°C/W
Ψ_JT	Junction-to-top characterization parameter	30.1	45.5	°C/W
Ψ_JB	Junction-to-board characterization parameter	42.2	89.1	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.