米6体育平台手机版

ZHCSO57G January 1998 – May 2021 CD54HC14 , CD74HC14

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		CD74HC14			UNIT
		PW (TSSOP)	N (PDIP)	D (SOIC)
		14 PINS	14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	151.7	69.3	133.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	79.4	57.4	89.0	°C/W
R_θJB	Junction-to-board thermal resistance	94.7	49.0	89.5	°C/W
Ψ_JT	Junction-to-top characterization parameter	25.2	37.4	45.5	°C/W
Ψ_JB	Junction-to-board characterization parameter	94.1	48.8	89.1	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.