米6体育平台手机版

ZHCSOB4H November 1998 – June 2021 CD54HC4075 , CD74HC4075

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		CD74HC4075				UNIT
		PW (TSSOP)	N (PDIP)	D (SOIC)	NS (SOP)
		14 PINS	14 PINS	14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	151.7	61.3	133.6	122.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	79.4	49.0	89.0	81.8	°C/W
R_θJB	Junction-to-board thermal resistance	94.7	41.0	89.5	83.8	°C/W
Ψ_JT	Junction-to-top characterization parameter	25.2	28.7	45.5	45.4	°C/W
Ψ_JB	Junction-to-board characterization parameter	94.1	40.8	89.1	83.4	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.