ZHCSQW1E December   1998  – August 2022 CD54HC4511 , CD74HC4511 , CD74HCT4511

PRODUCTION DATA  

  1. 1 特性
  2. 2 说明
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Recommended Operating Conditions for 'HC4511 (1)
    3. 5.3  Recommended Operating Conditions for CD74HCT4511 (1)
    4. 5.4  Thermal Information
    5. 5.5  'HC4511 Electrical Characteristics
    6. 5.6  CD74HCT4511 Electrical Characteristics
    7. 5.7  'HC4511 Timing Requirements
    8. 5.8  Switching Characteristics
    9. 5.9  CD74HCT4511 Timing Requirements
    10. 5.10 CD74HCT4511 Switching Characteristics
    11. 5.11 Operating Characteristics
  6. 6 Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 接收文档更新通知
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 术语表
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PW|16
  • N|16
  • D|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1) D (SOIC) N (PDIP) PW (TSSOP) UNIT
16 PINS 16 PINS 16 PINS
RθJA Package thermal impedance 67 73 108 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.
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