米6体育平台手机版

ZHCSPK9C February 2001 – May 2022 CD54HC573 , CD74HC573

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

5.3 Thermal Information

THERMAL METRIC		DW (SOIC)	N (PDIP)	UNIT
THERMAL METRIC		20 PINS	20 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance^⁽¹⁾	109.1	84.6	°C/W
R_{θJC (top)}	Junction-to-case (top) thermal resistance	76	72.5	°C/W
R_θJB	Junction-to-board thermal resistance	77.6	65.3	°C/W
Ψ_JT	Junction-to-top characterization parameter	51.5	55.3	°C/W
Ψ_JB	Junction-to-board characterization parameter	77.1	65.2	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.