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ZHCSOB5E November 1998 – June 2021 CD54HC7266 , CD74HC7266

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

6.3 Thermal Information

THERMAL METRIC⁽¹⁾		CD74HC7266		UNIT
		N (PDIP)	D (SOIC)
		14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	64.8	133.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	52.6	89.0	°C/W
R_θJB	Junction-to-board thermal resistance	44.6	89.5	°C/W
Ψ_JT	Junction-to-top characterization parameter	32.2	45.5	°C/W
Ψ_JB	Junction-to-board characterization parameter	44.3	89.1	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.