米6体育平台手机版

ZHCSOB9 June 2020 CD54HCT10 , CD74HCT10

PRODUCTION DATA

6.3 Thermal Information

THERMAL METRIC⁽¹⁾		CD74HCT10		UNIT
		N (PDIP)	D (SOIC)
		14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	61.9	94.5	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	49.7	48.9	°C/W
R_θJB	Junction-to-board thermal resistance	41.7	50.7	°C/W
Ψ_JT	Junction-to-top characterization parameter	29.3	11.9	°C/W
Ψ_JB	Junction-to-board characterization parameter	41.4	50.2	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.