米6体育平台手机版

ZHCSPR5J March 1998 – October 2022 CD54HC112 , CD54HCT112 , CD74HC112 , CD74HCT112

PRODMIX

请参考 PDF 数据表获取器件具体的封装图。

5.3 Thermal Information

THERMAL METRIC		D (SOIC)	N (PDIP)	NS (SO)	PW (TSSOP)	UNIT
THERMAL METRIC		16 PINS	16 PINS	16 PINS	16 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance^⁽¹⁾	117.2	69.3	88.4	137.5	°C/W
R_{θJC (top)}	Junction-to-case (top) thermal resistance	77.2	61.8	46	75.3	°C/W
R_θJB	Junction-to-board thermal resistance	75.6	49.3	50.6	82.2	°C/W
Ψ_JT	Junction-to-top characterization parameter	38.1	34.6	13	25.1	°C/W
Ψ_JB	Junction-to-board characterization parameter	75.3	49	50.2	81.8	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.