米6体育平台手机版

ZHCSOD0 June 2020 CD54HCT30 , CD74HCT30

PRODUCTION DATA

6.3 Thermal Information

THERMAL METRIC⁽¹⁾		CD74HCT30		UNIT
		N (PDIP)	D (SOIC)
		14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	64.7	101.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	52.4	58.3	°C/W
R_θJB	Junction-to-board thermal resistance	44.4	57.7	°C/W
Ψ_JT	Junction-to-top characterization parameter	32.0	19.6	°C/W
Ψ_JB	Junction-to-board characterization parameter	44.2	57.3	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.