米6体育平台手机版

ZHCSPW8E February 2001 – June 2022 CD54HCT373 , CD74HCT373

PRODUCTION DATA

5.3 Thermal Information

THERMAL METRIC		DW (SOIC)	N (PDIP)	UNIT
THERMAL METRIC		20 PINS	20 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance^⁽¹⁾	109.1	84.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	76	72.5	°C/W
R_θJB	Junction-to-board thermal resistance	77.6	65.3	°C/W
ψ_JT	Junction-to-top characterization parameter	51.5	55.3	°C/W
ψ_JB	Junction-to-board characterization parameter	77.1	65.2	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.