ZHCSQ70F September   1997  – March 2022 CD54HC393 , CD54HCT393 , CD74HC393 , CD74HCT393

PRODUCTION DATA  

  1. 1 特性
  2. 2 说明
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings (1)
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Prerequisite for Switching Characteristics
    6. 5.6 Switching Characteristics
  6. 6 Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 接收文档更新通知
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|14
  • N|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.1 Absolute Maximum Ratings(1)

MIN MAX UNIT
VCC Supply voltage –0.5 7 V
IIK Input diode current For VI < –0.5 V or VI > VCC + 0.5 V ±20 mA
IOK Output diode current For VO < –0.5 V or VO > VCC + 0.5 V ±20 mA
IO Output source or sink current per output pin For VO> –0.5 V or VO < VCC + 0.5 V ±25 mA
Continous current through VCC or GND ±50 mA
TJ Junction temperature 150 °C
Tstg Storage temperature range – 65 150 °C
Lead temperature (Soldering 10s) (SOIC - lead tips only) 300 °C
(1) Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
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