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ZHCSVX6C January 2004 – April 2024 CD74HCT4051-Q1

PRODUCTION DATA

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机械数据 (封装 | 引脚)

D|16

散热焊盘机械数据 (封装 | 引脚)

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5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾

			MIN	MAX	UNIT
V_CC– V_EE⁽²⁾	DC Supply voltage		-0.5	10.5	V
V_CC			–0.5	7	V
V_EE			0.5	-7	V
I_IK	DC input diode current	V_I < – 0.5V or V_I > V_CC + 0.5V	–20	20	mA
I_OK	DC switch diode current	V_I < V_EE – 0.5V or V_I > V_CC + 0.5V	–20	20	mA
I_OK	DC switch current	V_I < V_EE – 0.5V or V_I > V_CC + 0.5V	-25	25	mA
I_CC	DC V_CC or ground current		–50	50	mA
I_EE	DC V_EE current		–20		mA
R_θJA	Package thermal impedance⁽³⁾			91.6	°C/W
T_JMAX	Maximum junction temperature			150	°C
T_LMAX	Maximum lead temperature	Soldering 10 s		300	°C
T_stg	Storage temperature		–65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltages are with respect to ground, unless otherwise specified.

(3) The package thermal impedance is calculated in accordance with JESD 51-7