ZHCSPO7E February 2001 – June 2022 CD54HCT573 , CD74HCT573
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
| THERMAL METRIC | DW (SOIC) | DB (SSOP) | N (PDIP) | UNIT | |
|---|---|---|---|---|---|
| 20 PINS | 20 PINS | 20 PINS | |||
| RθJA | Junction-to-ambient thermal resistance(1) | 109.1 | 122.7 | 84.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 76 | 81.6 | 72.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 77.6 | 77.5 | 65.3 | °C/W |
| ψJT | Junction-to-top characterization parameter | 51.5 | 46.1 | 55.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 77.1 | 77.1 | 65.2 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | °C/W |