米6体育平台手机版

ZHCSPT1G February 1998 – October 2022 CD54HC73 , CD74HC73 , CD74HCT73

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

5.3 Thermal Information

THERMAL METRIC		D (SOIC)	N (PDIP)	UNIT
THERMAL METRIC		14 PINS	14 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance^⁽¹⁾	138.7	91	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	93.8	78.9	°C/W
R_θJB	Junction-to-board thermal resistance	94.7	70.7	°C/W
ψ_JT	Junction-to-top characterization parameter	49.1	58.6	°C/W
ψ_JB	Junction-to-board characterization parameter resistance	94.3	70.5	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.