ZHCSOC5A June   2020  – August 2024 CD54HCT86 , CD74HCT86

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Operating Characteristics
    8. 5.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 TTL-Compatible CMOS Inputs
      3. 7.3.3 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

说明

此器件包含四个独立双输入异或门。每个逻辑门以正逻辑执行布尔函数 Y = A ⊕ B。

器件信息
器件型号 封装(1) 封装尺寸(2) 本体尺寸(3)
CDx4HCT86 D(SOIC,14) 8.65mm × 6mm 8.65mm × 3.9mm
N(PDIP,14) 19.30mm × 9.4mm 19.30mm × 6.35mm
J(CDIP,14) 19.56mm x 6.7mm 19.56mm × 4.57mm
如需了解更多信息,请参阅机械、封装和可订购信息
封装尺寸(长 × 宽)为标称值,并包括引脚(如适用)。
本体尺寸(长 × 宽)为标称值,不包括引脚。
CD74HCT86 CD54HCT86 功能引脚分配功能引脚分配