ZHCSKG8A November   2019  – February 2020 CDCDB2000

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      CDCDB2000 系统图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. Table 1. Absolute Maximum Ratings
    2. Table 2. ESD Ratings
    3. Table 3. Recommended Operating Conditions
    4. Table 4. Thermal Information
    5. Table 5. Electrical Characteristics
    6. Table 6. Timing Requirements
    7. 6.1      Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Enable Control
      2. 7.3.2 SMBus
        1. 7.3.2.1 SMBus Address Assignment
      3. 7.3.3 Side-Band Interface
    4. 7.4 Device Functional Modes
      1. 7.4.1 CKPWRGD_PD# Function
      2. 7.4.2 OE[12:5]# and SMBus Output Enables
    5. 7.5 Programming
      1. 7.5.1 SMBus
      2. 7.5.2 SBI
    6. 7.6 Register Maps
      1. 7.6.1 CDCDB2000 Registers
        1. 7.6.1.1  OECR1 Register (Address = 0h) [reset = 78h]
          1. Table 11. OECR1 Register Field Descriptions
        2. 7.6.1.2  OECR2 Register (Address = 1h) [reset = FFh]
          1. Table 12. OECR2 Register Field Descriptions
        3. 7.6.1.3  OECR3 Register (Address = 2h) [reset = FFh]
          1. Table 13. OECR3 Register Field Descriptions
        4. 7.6.1.4  OERDBK Register (Address = 3h) [reset = 0h]
          1. Table 14. OERDBK Register Field Descriptions
        5. 7.6.1.5  SBRDBK Register (Address = 4h) [reset = 1h]
          1. Table 15. SBRDBK Register Field Descriptions
        6. 7.6.1.6  VDRREVID Register (Address = 5h) [reset = X]
          1. Table 16. VDRREVID Register Field Descriptions
        7. 7.6.1.7  DEVID Register (Address = 6h) [reset = X]
          1. Table 17. DEVID Register Field Descriptions
        8. 7.6.1.8  BTRDCNT Register (Address = 7h) [reset = 8h]
          1. Table 18. BTRDCNT Register Field Descriptions
        9. 7.6.1.9  SBIMSK1 Register (Address = 8h) [reset = 0h]
          1. Table 19. SBIMSK1 Register Field Descriptions
        10. 7.6.1.10 SBIMSK2 Register (Address = 9h) [reset = 0h]
          1. Table 20. SBIMSK2 Register Field Descriptions
        11. 7.6.1.11 SBIMSK3 Register (Address = Ah) [reset = 0h]
          1. Table 21. SBIMSK3 Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Enable Control Method
        2. 8.2.2.2 SMBus Address
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 TICS Pro
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

CDCDB2000 NPP Package
80-Pin TLGA
Top View
CDCDB2000 Pinout_SNAS787.gif

Pin Functions

PIN I/O TYPE DESCRIPTION
NAME NO.
INPUT CLOCK
CLKIN_P G1 I LP-HCSL differential clock input. Typically connected directly to the differential output of clock source.
CLKIN_N H1 I
OUTPUT CLOCKS
CK0_P J1 O LP-HCSL differential clock output of channel 0. Typically connected directly to PCIe differential clock input. If unused, the pins can be left no connect.
CK0_N K1 O
CK1_P L1 O LP-HCSL differential clock output of channel 1. Typically connected directly to PCIe differential clock input. If unused, the pins can be left no connect.
CK1_N M1 O
CK2_P M2 O LP-HCSL differential clock output of channel 2. Typically connected directly to PCIe differential clock input. If unused, the pins can be left no connect.
CK2_N M3 O
CK3_P M4 O LP-HCSL differential clock output of channel 3. Typically connected directly to PCIe differential clock input. If unused, the pins can be left no connect.
CK3_N M5 O
CK4_P M7 O LP-HCSL differential clock output of channel 4. Typically connected directly to PCIe differential clock input. If unused, the pins can be left no connect.
CK4_N M8 O
CK5_P M9 O LP-HCSL differential clock output of channel 5. Typically connected directly to PCIe differential clock input. If unused, the pins can be left no connect, and pin L8 (OE5# / DATA) is recommended to be either in DATA mode or pulled high.
CK5_N M10 O
CK6_P M11 O LP-HCSL differential clock output of channel 6. Typically connected directly to PCIe differential clock input. If unused, the pins can be left no connect, and pin L10 (OE6# / CLK) is recommended to be either in CLK mode or pulled high.
CK6_N M12 O
CK7_P L12 O LP-HCSL differential clock output of channel 7. Typically connected directly to PCIe differential clock input. If unused, the pins can be left no connect, and pin K11 (OE7#) is recommended to be pulled high to disable channel 7 output.
CK7_N K12 O
CK8_P J12 O LP-HCSL differential clock output of channel 8. Typically connected directly to PCIe differential clock input. If unused, the pins can be left no connect, and pin H11 (OE8#) is recommended to be pulled high to disable channel 8 output.
CK8_N H12 O
CK9_P G12 O LP-HCSL differential clock output of channel 9. Typically connected directly to PCIe differential clock input. If unused, the pins can be left no connect, and pin E12 (OE9#) is recommended to be pulled high to disable channel 9 output.
CK9_N F12 O
CK10_P D12 O LP-HCSL differential clock output of channel 10. Typically connected directly to PCIe differential clock input. If unused, the pins can be left no connect, and pin E11 (OE10# / SHFT_LD#) is recommended to be either in SHFT_LD# mode or pulled high.
CK10_N C12 O
CK11_P B12 O LP-HCSL differential clock output of channel 11. Typically connected directly to PCIe differential clock input. If unused, the pins can be left no connect, and pin C11 (OE11#) is recommended to be pulled high to disable channel 11 output.
CK11_N A12 O
CK12_P A11 O LP-HCSL differential clock output of channel 12. Typically connected directly to PCIe differential clock input. If unused, the pins can be left no connect, and pin B10 (OE12#) is recommended to be pulled high to disable channel 12 output.
CK12_N A10 O
CK13_P A9 O LP-HCSL differential clock output of channel 13. Typically connected directly to PCIe differential clock input. If unused, the pins can be left no connect.
CK13_N A8 O
CK14_P A7 O LP-HCSL differential clock output of channel 14. Typically connected directly to PCIe differential clock input. If unused, the pins can be left no connect.
CK14_N A6 O
CK15_P A5 O LP-HCSL differential clock output of channel 15. Typically connected directly to PCIe differential clock input. If unused, the pins can be left no connect.
CK15_N A4 O
CK16_P A3 O LP-HCSL differential clock output of channel 16. Typically connected directly to PCIe differential clock input. If unused, the pins can be left no connect.
CK16_N A2 O
CK17_P A1 O LP-HCSL differential clock output of channel 17. Typically connected directly to PCIe differential clock input. If unused, the pins can be left no connect.
CK17_N B1 O
CK18_P C1 O LP-HCSL differential clock output of channel 18. Typically connected directly to PCIe differential clock input. If unused, the pins can be left no connect.
CK18_N D1 O
CK19_P E1 O LP-HCSL differential clock output of channel 19. Typically connected directly to PCIe differential clock input. If unused, the pins can be left no connect.
CK19_N F1 O
MANAGEMENT AND CONTROL
CKPWRGD_PD# M6 I, PD Clock Power Good and Power Down multi-function input pin with internal 120-kΩ pulldown. Typically connected to GPIO of microcontroller. If unused, the pin can be left no connect.

On first high transition, PWRGD samples the latched SADR[1:0] inputs and starts up device. After PWRGD has been asserted high for the first time, the pin becomes a PD# pin and it controls power-down mode:
LOW: Power-down mode, all output channels tri-stated.
HIGH: Normal operation mode.
OE5#
DATA		 L8 I, PD Output enable for channel 5 and Side-Band Interface data multi-function pin with internal 120-kΩ pulldown. Typically connected to GPIO of microcontroller. If both modes are unused, the pin can be left no connect.

When pin E2 = LOW, OE5# mode. Output enable for channel 5, active low.
LOW: enable output channel 5.
HIGH: disable output channel 5.

When pin E2 = HIGH, DATA mode. Side-Band Interface data pin.
OE6#
CLK		 L10 I, PD Output enable for channel 6 and Side-Band Interface clock multi-function pin with internal 120-kΩ pulldown. Typically connected to GPIO of microcontroller. If both modes are unused, the pin can be left no connect.

When pin E2 = LOW, OE6# mode. Output Enable for channel 6, active low.
LOW: enable output channel 6.
HIGH: disable output channel 6.

When pin E2 = HIGH, CLK mode. Side-Band interface clock pin.
OE7# K11 I, PD Output Enable for channel 7 with internal 120-kΩ pulldown, active low. Typically connected to GPIO of microcontroller. If unused, the pin can be left no connect.
LOW: enable output channel 7.
HIGH: disable output channel 7.
OE8# H11 I, PD Output Enable for channel 8, with internal 120-kΩ pulldown, active low. Typically connected to GPIO of microcontroller. If unused, the pin can be left no connect.
LOW: enable output channel 8.
HIGH: disable output channel 8.
OE9# E12 I, PD Output Enable for channel 9, with internal 120-kΩ pulldown, active low. Typically connected to GPIO of microcontroller. If unused, the pin can be left no connect.
LOW: enable output channel 9.
HIGH: disable output channel 9.
OE10#
SHFT_LD#		 E11 I, PD Output enable for channel 10 and Side-Band Interface load shift registers multi-function pin with internal 120-kΩ pulldown. Typically connected to GPIO of microcontroller. If both modes are unused, the pin can be left no connect.

When pin E2 = LOW, OE10# mode. Output Enable for channel 10, active low.
LOW: enable output channel 10.
HIGH: disable output channel 10.

When pin E2 = HIGH, SHFT_LD# mode. Side-Band Interface load shift registers pin.
LOW: disable Side-Band Interface shift register.
HIGH: enable Side-Band Interface shift register.
A falling edge transfers the Side-Band shift register contents to the output register.
OE11# C11 I, PD Output Enable for channel 11 with internal 120-kΩ pulldown, active low. Typically connected to GPIO of microcontroller. If unused, the pin can be left no connect.
LOW: enable output channel 11.
HIGH: disable output channel 11.
OE12# B10 I, PD Output Enable for channel 12 with internal 120-kΩ pulldown, active low. Typically connected to GPIO of microcontroller. If unused, the pin can be left no connect.
LOW: enable output channel 12.
HIGH: disable output channel 12.
SBEN E2 I, S, PD Side-Band Interface enable input with internal 120-kΩ pulldown. Typically connected to GPIO of microcontroller. If unused, the pin can be left no connect. This pin disables the Output Enable (OE#) pins when asserted.
LOW: OE# pins and SMBus enable bits control outputs, Side-Band interface disabled.
HIGH: Side-Band Interface controls outputs, OE# pins and SMBus enable bits are disabled.
SMBUS AND SMBUS ADDRESS
SADR0 B4 I, S, PU / PD SMBus address strap bit[0]. This is a 3-level input that is decoded in conjunction with pin B8 to set SMBus address. It has internal 120-kΩ pullup / pulldown network biasing to VDD/2 when no connect.
For a high-level input configuration, the pin should be pulled up to 3.3-V VDD through an external pullup resistor from 1k to 5k with 5% tolerance.
For a low-level input configuration input, the pin should be pulled down to ground through an external pulldown resistor from 1k to 5k with 5% tolerance.
For a mid-level input configuration, the pin should be left floating and not connected to VDD or ground.
SADR1 B8 I, S, PU / PD SMBus address strap bit[1]. This is a 3-level input that is decoded in conjunction with pin B4 to set SMBus address. It has internal 120-kΩ pullup / pulldown network biasing to VDD/2 when no connect.
For a high-level input configuration, the pin should be pulled up to 3.3-V VDD through an external pullup resistor from 1k to 5k with 5% tolerance.
For a low-level input configuration, the pin should be pulled down to ground through an external pulldown resistor from 1k to 5k with 5% tolerance.
For a mid-level input configuration, the pin should be left floating and not connected to VDD or ground.
SMBCLK L5 I Clock pin of SMBus interface. Typically pulled up to 3.3-V VDD using external pullup resistor. The recommended pullup resistor value is > 8.5k.
SMBDAT L4 I / O Data pin of SMBus interface. Typically pulled up to 3.3-V VDD using external pullup resistor. The recommended pullup resistor value is > 8.5k.
SUPPLY VOLTAGE AND GROUND
GND DAP G Ground. Connect ground pad to system ground.
VDD B2, B6, B11, L2, L11 P Power supply input for LP-HCSL clock output channels. Connect to 3.3-V power supply rail with decoupling capacitor to GND. Place a 0.1-µF capacitor close to each supply pin between power supply and ground.
VDD_A H2 P Power supply input for differential input clock. Connect to 3.3-V power supply rail with decoupling capacitor to GND. Place a 0.1-µF capacitor close to pin.
NO CONNECT
NC B3, B5, B7, B9, C2, D2, D11, F2, F11, G2, G11, J2, J11, K2, L3, L6, L7, L9, — Do not connect to GND or VDD.

The “#” symbol at the end of a pin name indicates that the active state occurs when the signal is at a low voltage level. When “#” is not present, the signal is active high.

The definitions below define the I/O type for each pin.

  • I = Input
  • O = Output
  • I / O = Input / Output
  • PU / PD = Internal 120-kΩ Pullup / Pulldown network biasing to VDD/2
  • PD = Internal 120-kΩ Pulldown
  • S = Hardware Configuration Pin
  • P = Power Supply
  • G = Ground
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