ZHCSKG8B November 2019 – October 2024 CDCDB2000
PRODUCTION DATA
THERMAL METRIC(1) | CDCDB2000 | UNIT | |
---|---|---|---|
NPP (GQFN) | |||
80 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 32.7 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 31.2 | °C/W |
RθJB | Junction-to-board thermal resistance | 15.9 | °C/W |
ΨJT | Junction-to-top characterization parameter | 0.4 | °C/W |
ΨJB | Junction-to-board characterization parameter | 15.8 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.5 | °C/W |