Figure 8-3 and Figure 8-4 are PCB layout examples that show the application of thermal design practices and a low-inductance ground connection between the device DAP and the PCB.

The CDCDB2000 has 85-Ω differential output impedance LP-HCSL format drivers. All transmission lines connected to CKx pins should be 85-Ω differential impedance, 42.5-Ω single-ended impedance to avoid reflections and increased radiated emissions. Take care to eliminate or reduce stubs on the transmission lines.

Figure 8-3 PCB Layout Example for CDCDB2000, Top Layer

Figure 8-4 PCB Layout Example for CDCDB2000, GND Layer

Figure 8-5 PCB Layout Example for CDCDB2000, Bottom Layer