米6体育平台手机版

ZHCSOD8A November 2021 – May 2022 CDCDB400

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		CDCDB400	UNIT
		RHB (QFN)
		32 PINS
R_θJA	Junction-to-ambient thermal resistance	35.3	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	27.3	°C/W
R_θJB	Junction-to-board thermal resistance	16.2	°C/W
Ψ_JT	Junction-to-top characterization parameter	0.6	°C/W
Ψ_JB	Junction-to-board characterization parameter	16.2	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	6.1	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.