米6体育平台手机版

ZHCSM95B July 2021 – May 2022 CDCDB800

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		Device Package	UNIT
		RSL (QFN)
		48 PINS
R_θJA	Junction-to-ambient thermal resistance	32.2	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	22.3	°C/W
R_θJB	Junction-to-board thermal resistance	14.3	°C/W
Ψ_JT	Junction-to-top characterization parameter	0.5	°C/W
Ψ_JB	Junction-to-board characterization parameter	14.2	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	6.1	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.