ZHCSUH0G August 2007 – January 2024 CDCE949 , CDCEL949
PRODUCTION DATA
THERMAL METRIC(2) | CDCEx949 | UNIT | ||
---|---|---|---|---|
PW (TSSOP) | ||||
24 PINS | ||||
θJA | Junction-to-ambient thermal resistance(1) | Airflow 0 (LFM) | 91 | °C/W |
Airflow 150 (LFM) | 75 | |||
Airflow 200 (LFM) | 74 | |||
Airflow 250 (LFM) | 73 | |||
Airflow 500 (LFM) | 65 | |||
θJCtop | Junction-to-case (top) thermal resistance | 0.5 | °C/W | |
θJB | Junction-to-board thermal resistance | 52 | °C/W | |
ψJT | Junction-to-top characterization parameter | 0.5 | °C/W | |
ψJB | Junction-to-board characterization parameter | 50.1 | °C/W | |
θJCbot | Junction-to-case (bottom) thermal resistance | 50 | °C/W |