ZHCSTF3I June   2007  – August 2024 CDCE913 , CDCEL913

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 EEPROM Specification
    7. 5.7 Timing Requirements: CLK_IN
    8. 5.8 Timing Requirements: SDA/SCL #GUID-DE171716-D3A0-4375-A25C-58C636304087/SCAS849414
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Control Terminal Configuration
      2. 7.3.2 Default Device Configuration
      3. 7.3.3 SDA/SCL Serial Interface
      4. 7.3.4 Data Protocol
    4. 7.4 Device Functional Modes
      1. 7.4.1 SDA/SCL Hardware Interface
    5. 7.5 Programming
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Spread-Spectrum Clock (SSC)
        2. 8.2.2.2 PLL Frequency Planning
        3. 8.2.2.3 Crystal Oscillator Start-up
        4. 8.2.2.4 Frequency Adjustment with Crystal Oscillator Pulling
        5. 8.2.2.5 Unused Inputs/Outputs
        6. 8.2.2.6 Switching Between XO and VCXO Mode
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Register Maps
    1. 9.1 SDA/SCL Configuration Registers
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

8.3 Power Supply Recommendations

When using an external reference clock, XIN/CLK must be driven before VDD ramps to avoid risk of unstable output. If VDDOUT is applied before VDD, TI recommends keeping VDD pulled to GND until VDDOUT is ramped. In case the VDDOUT is powered while VDD is floating, there is a risk of high current flowing on the VDDOUT.

The device has a power-up control that is connected to the 1.8-V supply. This disables the entire device until the 1.8-V supply reaches a sufficient voltage level. Then, the device switches on all internal components, including the outputs. If there is a 3.3-V VDDOUT available before the 1.8-V, the outputs stay disabled until the 1.8-V supply reaches a certain level.
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