ZHCSGV7F
July 2017 – January 2024
CDCI6214
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Device Comparison
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
EEPROM Characteristics
6.6
Reference Input, Single-Ended and Differential Mode Characteristics (REFP, REFN, FB_P, FB_N)
6.7
Reference Input, Crystal Mode Characteristics (XIN, XOUT)
6.8
General-Purpose Input and Output Characteristics (GPIO[4:1], SYNC/RESETN)
6.9
Triple Level Input Characteristics (EEPROMSEL, REFSEL)
6.10
Reference Mux Characteristics
6.11
Phase-Locked Loop Characteristics
6.12
Closed-Loop Output Jitter Characteristics
6.13
Output Mux Characteristics
6.14
LVCMOS Output Characteristics
6.15
HCSL Output Characteristics
6.16
LVDS DC-Coupled Output Characteristics
6.17
Programmable Differential AC-Coupled Output Characteristics
6.18
Output Skew and Delay Characteristics
6.19
Output Synchronization Characteristics
6.20
Timing Characteristics
6.21
I2C-Compatible Serial Interface Characteristics (SDA/GPIO2, SCL/GPIO3)
6.22
Timing Requirements, I2C-Compatible Serial Interface (SDA/GPIO2, SCL/GPIO3)
6.23
Power Supply Characteristics
6.24
Typical Characteristics
7
Parameter Measurement Information
7.1
Parameters
7.1.1
Reference Inputs
7.1.2
Outputs
7.1.3
Serial Interface
7.1.4
Power Supply
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Reference Block
8.3.1.1
Input Stages
8.3.1.1.1
Crystal Oscillator
8.3.1.1.2
LVCMOS
8.3.1.1.3
Differential AC-Coupled
8.3.1.2
Reference Mux
8.3.1.3
Reference Divider
8.3.1.3.1
Doubler
8.3.1.4
Bypass-Mux
8.3.1.5
Zero Delay, Internal and External Path
8.3.2
Phase-Locked Loop
8.3.3
Clock Distribution
8.3.3.1
Output Channel
8.3.3.2
Divider Glitch-Less Update
8.3.4
Control Pins
8.3.4.1
Global and Individual Output Enable: OE and OE_Y[4:1]
8.3.5
Operation Modes
8.3.6
Divider Synchronization - SYNC
8.3.7
EEPROM - Cyclic Redundancy Check
8.3.8
Power Supplies
8.3.8.1
Power Management
8.4
Device Functional Modes
8.4.1
Pin Mode
8.4.2
Serial Interface Mode
8.4.2.1
Fall-Back Mode
8.5
Programming
8.5.1
Recommended Programming Procedure
8.5.2
EEPROM Access
8.5.3
Device Defaults
9
Application and Implementation
9.1
Application Information
9.2
Typical Applications
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curves
9.3
Do's and Don'ts
9.4
Initialization Setup
9.5
Power Supply Recommendations
9.5.1
Power-Up Sequence
9.5.2
De-Coupling
9.6
Layout
9.6.1
Layout Guidelines
9.6.2
Layout Examples
10
Register Maps
10.1
CDCI6214 Registers
10.2
EEPROM Map
11
Device and Documentation Support
11.1
Device Support
11.1.1
Development Support
11.1.2
Device Nomenclature
11.2
接收文档更新通知
11.3
支持资源
11.4
Trademarks
11.5
静电放电警告
11.6
术语表
12
Revision History
13
Mechanical, Packaging, and Orderable Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
RGE|24
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsgv7f_oa
zhcsgv7f_pm
9.2
Typical Applications
Figure 9-1
Typical
Serial Interface
Application Schematic
Figure 9-2
Typical
Individual Output Enable
Application Schematic
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