ZHCSGV7F
July 2017 – January 2024
CDCI6214
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Device Comparison
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
EEPROM Characteristics
6.6
Reference Input, Single-Ended and Differential Mode Characteristics (REFP, REFN, FB_P, FB_N)
6.7
Reference Input, Crystal Mode Characteristics (XIN, XOUT)
6.8
General-Purpose Input and Output Characteristics (GPIO[4:1], SYNC/RESETN)
6.9
Triple Level Input Characteristics (EEPROMSEL, REFSEL)
6.10
Reference Mux Characteristics
6.11
Phase-Locked Loop Characteristics
6.12
Closed-Loop Output Jitter Characteristics
6.13
Output Mux Characteristics
6.14
LVCMOS Output Characteristics
6.15
HCSL Output Characteristics
6.16
LVDS DC-Coupled Output Characteristics
6.17
Programmable Differential AC-Coupled Output Characteristics
6.18
Output Skew and Delay Characteristics
6.19
Output Synchronization Characteristics
6.20
Timing Characteristics
6.21
I2C-Compatible Serial Interface Characteristics (SDA/GPIO2, SCL/GPIO3)
6.22
Timing Requirements, I2C-Compatible Serial Interface (SDA/GPIO2, SCL/GPIO3)
6.23
Power Supply Characteristics
6.24
Typical Characteristics
7
Parameter Measurement Information
7.1
Parameters
7.1.1
Reference Inputs
7.1.2
Outputs
7.1.3
Serial Interface
7.1.4
Power Supply
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Reference Block
8.3.1.1
Input Stages
8.3.1.1.1
Crystal Oscillator
8.3.1.1.2
LVCMOS
8.3.1.1.3
Differential AC-Coupled
8.3.1.2
Reference Mux
8.3.1.3
Reference Divider
8.3.1.3.1
Doubler
8.3.1.4
Bypass-Mux
8.3.1.5
Zero Delay, Internal and External Path
8.3.2
Phase-Locked Loop
8.3.3
Clock Distribution
8.3.3.1
Output Channel
8.3.3.2
Divider Glitch-Less Update
8.3.4
Control Pins
8.3.4.1
Global and Individual Output Enable: OE and OE_Y[4:1]
8.3.5
Operation Modes
8.3.6
Divider Synchronization - SYNC
8.3.7
EEPROM - Cyclic Redundancy Check
8.3.8
Power Supplies
8.3.8.1
Power Management
8.4
Device Functional Modes
8.4.1
Pin Mode
8.4.2
Serial Interface Mode
8.4.2.1
Fall-Back Mode
8.5
Programming
8.5.1
Recommended Programming Procedure
8.5.2
EEPROM Access
8.5.3
Device Defaults
9
Application and Implementation
9.1
Application Information
9.2
Typical Applications
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curves
9.3
Do's and Don'ts
9.4
Initialization Setup
9.5
Power Supply Recommendations
9.5.1
Power-Up Sequence
9.5.2
De-Coupling
9.6
Layout
9.6.1
Layout Guidelines
9.6.2
Layout Examples
10
Register Maps
10.1
CDCI6214 Registers
10.2
EEPROM Map
11
Device and Documentation Support
11.1
Device Support
11.1.1
Development Support
11.1.2
Device Nomenclature
11.2
接收文档更新通知
11.3
支持资源
11.4
Trademarks
11.5
静电放电警告
11.6
术语表
12
Revision History
13
Mechanical, Packaging, and Orderable Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
RGE|24
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsgv7f_oa
zhcsgv7f_pm
11.5
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。米6体育平台手机版_好二三四 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。
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