ZHCSD30 November 2014 CDCL1810A
PRODUCTION DATA.
- 1 特性
- 2 应用
- 3 说明
- 4 简化电路原理图
- 5 修订历史记录
- 6 Device Comparison Tables
- 7 Pin Configuration and Functions
- 8 Specifications
- 9 Detailed Description
- 10Application and Implementation
- 11Power Supply Recommendations
- 12Layout
- 13器件和文档支持
- 14机械封装和可订购信息
12 Layout
12.1 Layout Guidelines
- Keep the connections between the bypass capacitors and the power supply on the device as short as possible.
- Ground the other side of the capacitor using a low impedance connection to the ground plane.
- If the capacitors are mounted on the back side, 0402 components can be employed; however, soldering to the Thermal Dissipation Pad can be difficult.
- For component side mounting, use 0201 body size capacitors to facilitate signal routing.
NOTE
The device must be soldered to ground (VSS) using as many ground vias as possible. The device performance will be severely impacted if the exposed thermal pad is not grounded appropriately.
12.2 Layout Example
Figure 12. Layout Example: Signal Layer (TOP)
Figure 13. Layout Example: Bottom Layer with Decoupling Capacitors