SCAS886E August   2009  – December 2015 CDCLVP1212

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: LVCMOS Input
    6. 7.6  Electrical Characteristics: Differential Input
    7. 7.7  Electrical Characteristics: LVPECL Output, At VCC = 2.375 V to 2.625 V
    8. 7.8  Electrical Characteristics: LVPECL Output, at VCC = 3.0 V to 3.6 V
    9. 7.9  Pin Characteristics
    10. 7.10 Timing Requirements
    11. 7.11 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Test Configurations
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 LVPECL Output Termination
      2. 9.4.2 Input Termination
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Fanout Buffer for Line Card Application
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Thermal Management
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Community Resources
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Device Comparison Table(1)

PACKAGED DEVICES TA FEATURES
CDCLVP1212RHAT –40°C to 85°C 40 terminal QFN (RHA) package, small tape and reel
CDCLVP1212RHAR –40°C to 85°C 40 terminal QFN (RHA) package, tape and reel
(1) For the most current specifications and package information, see the Package Option Addendum located at the end of this data sheet or refer to our web site at www.ti.com.
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