ZHCSF03 March   2016 CDCM6208V2G

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 简化电路原理图
  5. 修订历史记录
  6. 说明 (续)
  7. Pin Configuration and Functions
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information, Airflow = 0 LFM
    5. 8.5  Thermal Information, Airflow = 150 LFM
    6. 8.6  Thermal Information, Airflow = 250 LFM
    7. 8.7  Thermal Information, Airflow = 500 LFM
    8. 8.8  Single Ended Input Characteristics
    9. 8.9  Single Ended Input Characteristics (PRI_REF, SEC_REF)
    10. 8.10 Differential Input Characteristics (PRI_REF, SEC_REF)
    11. 8.11 Crystal Input Characteristics (SEC_REF)
    12. 8.12 Single Ended Output Characteristics (STATUS1, STATUS0, SDO, SDA)
    13. 8.13 PLL Characteristics
    14. 8.14 LVCMOS Output Characteristics
    15. 8.15 LVPECL (High-Swing CML) Output Characteristics
    16. 8.16 CML Output Characteristics
    17. 8.17 LVDS (Low-Power CML) Output Characteristics
    18. 8.18 HCSL Output Characteristics
    19. 8.19 Output Skew and Sync to Output Propagation Delay Characteristics
    20. 8.20 Device Individual Block Current Consumption
    21. 8.21 Worst Case Current Consumption
    22. 8.22 I2C TIMING
    23. 8.23 SPI Timing Requirements
    24. 8.24 Typical Characteristics
      1. 8.24.1 Fractional Output Divider Jitter Performance
      2. 8.24.2 Power Supply Ripple Rejection (PSRR) versus Ripple Frequency
  9. Parameter Measurement Information
    1. 9.1 Characterization Test Setup
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
    4. 10.4 Device Functional Modes
      1. 10.4.1 Control Pins Definition
      2. 10.4.2 Loop Filter Recommendations for Pin Modes
      3. 10.4.3 Status Pins Definition
      4. 10.4.4 PLL Lock Detect
      5. 10.4.5 Interface and Control
        1. 10.4.5.1 Register File Reference Convention
        2. 10.4.5.2 SPI - Serial Peripheral Interface
          1. 10.4.5.2.1 Configuring the PLL
    5. 10.5 Programming
      1. 10.5.1 Writing to the CDCM6208V2G
      2. 10.5.2 Reading from the CDCM6208V2G
      3. 10.5.3 Block Write/Read Operation
      4. 10.5.4 I2C Serial Interface
    6. 10.6 Register Maps
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Applications
      1. 11.2.1 Design Requirements
        1. 11.2.1.1  Device Block-level Description
        2. 11.2.1.2  Device Configuration Control
        3. 11.2.1.3  Configuring the RESETN Pin
        4. 11.2.1.4  Preventing False Output Frequencies in SPI/I2C Mode at Startup:
        5. 11.2.1.5  Power Down
        6. 11.2.1.6  Device Power Up Timing:
        7. 11.2.1.7  Input Mux and Smart Input Mux
        8. 11.2.1.8  Universal INPUT Buffer (PRI_REF, SEC_REF)
        9. 11.2.1.9  VCO Calibration
        10. 11.2.1.10 Reference Divider (R)
        11. 11.2.1.11 Input Divider (M)
        12. 11.2.1.12 Feedback Divider (N)
        13. 11.2.1.13 Prescaler Dividers (PS_A, PS_B)
        14. 11.2.1.14 Phase Frequency Detector (PFD)
        15. 11.2.1.15 Charge Pump (CP)
        16. 11.2.1.16 Programmable Loop Filter
          1. 11.2.1.16.1 Loop Filter Component Selection
          2. 11.2.1.16.2 Device Output Signaling
          3. 11.2.1.16.3 Integer Output Divider (IO)
          4. 11.2.1.16.4 Fractional Output Divider (FOD)
          5. 11.2.1.16.5 Output Synchronization
          6. 11.2.1.16.6 Output MUX on Y4 and Y5
          7. 11.2.1.16.7 Staggered CLK Output Powerup for Power Sequencing of a DSP
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Jitter Considerations in SERDES Systems
        2. 11.2.2.2 Jitter Considerations in ADC and DAC Systems
      3. 11.2.3 Application Performance Plots
        1. 11.2.3.1 Typical Device Jitter
  12. 12Power Supply Recommendations
    1. 12.1 Power Rail Sequencing, Power Supply Ramp Rate, and Mixing Supply Domains
      1. 12.1.1 Fast Power-up Supply Ramp
      2. 12.1.2 Delaying VDD_Yx_Yy to Protect DSP IOs
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
      1. 13.2.1 Reference Schematic
  14. 14器件和文档支持
    1. 14.1 文档支持
      1. 14.1.1 相关文档 
    2. 14.2 社区资源
    3. 14.3 商标
    4. 14.4 静电放电警告
    5. 14.5 Glossary
  15. 15机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7 Pin Configuration and Functions

RGZ Package
48 Pin VQFN
Top View
CDCM6208V2G CDCM6208_Pin_Assignments_SCAS931.gif

Pin Functions

PIN I/O TYPE DESCRIPTION
NAME NO.
PRI_REFP 8 Input Universal Primary Reference Input +
PRI_REFN 9 Input Universal Primary Reference Input –
VDD_PRI_REF 7 PWR Analog Supply pin for reference inputs to set between 1.8 V, 2.5 V, or 3.3 V or connect to VDD_SEC_REF.
SEC_REFP 11 Input Universal Secondary Reference Input +
SEC_REFN 12 Input Universal Secondary Reference Input –
VDD_SEC_REF 10 PWR Analog Supply pin for reference inputs to set between 1.8 V, 2.5 V, or 3.3 V or connect to VDD_PRI_REF(2).
REF_SEL 6 Input LVCMOS
50kΩ pull-up
Manual Reference Selection MUX for PLL. In SPI or I2C mode the reference selection is also controlled through Register 4 bit 12.
REF_SEL = 0 (≤ VIL): selects PRI_REF
REF_SEL = 1 (≥ VIH): selects SEC_REF (when Reg 4.12 = 1). See Table 35 for detail.
ELF 41 Output Analog External loop filter pin for PLL
Y0_P 14 Output Universal Output 0 Positive Terminal
Y0_N 15 Output Universal Output 0 Negative Terminal
Y1_P 17 Output Universal Output 1 Positive Terminal
Y1_N 16 Output Universal Output 1 Negative Terminal
VDD_Y0_Y1 (2 pins) 13, 18 PWR Analog Supply pin for outputs 0, 1 to set between 1.8 V, 2.5 V or 3.3 V
Y2_P 20 Output Universal Output 2 Positive Terminal
Y2_N 21 Output Universal Output 2 Negative Terminal
Y3_P 23 Output Universal Output 3 Positive Terminal
Y3_N 22 Output Universal Output 3 Negative Terminal
VDD_Y2_Y3 (2 pins) 19, 24 PWR Analog Supply pin for outputs 2, 3 to set between 1.8 V, 2.5 V or 3.3 V
Y4_P 26 Output Universal Output 4 Positive Terminal
Y4_N 25 Output Universal Output 4 Negative Terminal
VDD_Y4 27 PWR Analog Supply pin for output 4 to set between 1.8 V, 2.5 V or 3.3 V
Y5_P 29 Output Universal Output 5 Positive Terminal
Y5_N 28 Output Universal Output 5 Negative Terminal
VDD_Y5 30 PWR Analog Supply pin for output 5 to set between 1.8 V, 2.5 V or 3.3 V
Y6_P 32 Output Universal Output 6 Positive Terminal
Y6_N 33 Output Universal Output 6 Negative Terminal
VDD_Y6 31 PWR Analog Supply pin for output 6 to set between 1.8 V, 2.5 V or 3.3 V
Y7_P 35 Output Universal Output 7 Positive Terminal
Y7_N 36 Output Universal Output 7 Negative Terminal
VDD_Y7 34 PWR Analog Supply pin for output 7 to set between 1.8 V, 2.5 V or 3.3 V
VDD_VCO 39 PWR Analog Analog power supply for PLL/VCO; This pin is sensitive to power supply noise; The supply of this pin and the VDD_PLL2 supply pin can be combined as they are both analog and sensitive supplies
VDD_PLL1 37 PWR Analog Analog Power Supply Connections
VDD_PLL2 38 PWR Analog Analog Power Supply Connections; This pin is sensitive to power supply noise; The supply of VDD_PLL2 and VDD_VCO can be combined as these pins are both power-sensitive, analog supply pins
DVDD 48 PWR Analog Digital Power Supply Connections; This is also the reference supply voltage for all control inputs and must match the expected input signal swing of control inputs.
GND PAD PWR Analog Power Supply Ground and Thermal Pad
STATUS0 46 Output LVCMOS Status pin 0 (see Table 6 for details)
STATUS1/PIN0 45 Output/
Input
LVCMOS
no pull resistor
STATUS1: Status pin in SPI/I2C modes. For details see Table 4 for pin modes and Table 6 for status mode.
PIN0: Control pin 0 in pin mode.
SI_MODE1 47 Input LVCMOS
50kΩ pull-up
Serial Interface Mode or Pin mode selection.
SI_MODE[1:0]=00: SPI mode;
SI_MODE[1:0]=01: I2C mode;
SI_MODE[1:0]=10: Pin Mode (No serial programming);
SI_MODE[1:0]=11: RESERVED
SI_MODE0 1 Input LVCMOS
50kΩ pull-down
SDI/SDA/PIN1 2 Input/
Output
LVCMOS in
Open drain out
LVCMOS in
no pull resistor
SDI: SPI Serial Data Input
SDA: I2C Serial Data (Read/Write bi-directional), open drain output; requires a pull-up resistor in I2C mode;
PIN1: Control pin 1 in pin mode
SDO/AD0/PIN2 3 Output/
Input
LVCMOS out
LVCMOS in
LVCMOS in
no pull resistor
SDO: SPI Serial Data
AD0: I2C Address Offset Bit 0 input
PIN2: Control pin 2 in pin mode
SCS/AD1/PIN 3 4 Input LVCMOS
no pull resistor
SCS: SPI Latch Enable
AD1: I2C Address Offset Bit 1 input
PIN3: Control pin 3 in pin mode
SCL/PIN4 5 Input LVCMOS
no pull resistor
SCL: SPI/I2C Clock
PIN4: Control pin 4 in pin mode
RESETN/PWR 44 Input LVCMOS
50kΩ pull-up
In SPI/I2C programming mode, external RESETN signal (active low).
RESETN = V IL: device in reset (registers values are retained)
RESETN = V IH: device active. The device can be programmed via SPI while RESETN is held low (this is useful to avoid any false output frequencies at power up). (1)
In Pin mode this pin controls device core and I/O supply voltage setting. 0 = 1.8 V, 1 = 2.5/3.3 V for the device core and I/O power supply voltage. In pin mode, it is not possible to mix and match the supplies. All supplies should either be 1.8 V or 2.5/3.3 V.
REG_CAP 40 Output Analog Regulator Capacitor; connect a 10 µF cap with ESR below 1 Ω to GND at frequencies above 100 kHz
PDN 43 Input LVCMOS
50kΩ pull-up
Power Down Active low. When PDN = VIH is normal operation. When PDN = VIL, the device is disabled and current consumption minimized. Exiting power down resets the entire device and defaults all registers. It is recommended to connect a capacitor to GND to hold the device in power-down until the digital and PLL related power supplies are stable. See section on power down in the application section.
SYNCN 42 Input LVCMOS
50kΩ pull-up
Active low. Device outputs are synchronized on a low-to-high transition on the SYNCN pin. SYNCN held low disables all outputs.
(1) Note: the device cannot be programmed in I2C while RESETN is held low.
(2) If Secondary input buffer is disabled (Register 4 Bit 5 = 0), it is possible to connect VDD_SEC_REF to GND.